74AC2708SCQR
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | SOP, SOP28,.4 |
Reach Compliance Code | unknown |
最大时钟频率 (fCLK) | 30 MHz |
JESD-30 代码 | R-PDSO-G28 |
JESD-609代码 | e0 |
内存集成电路类型 | OTHER FIFO |
内存宽度 | 9 |
端子数量 | 28 |
字数 | 64 words |
字数代码 | 64 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 64X9 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP28,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 3.3/5 V |
最大待机电流 | 0.15 A |
最大压摆率 | 0.15 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
74AC2708SCQR | 54AC2708LMQR | 74AC2708FCQR | 54ACT2708DMQR | 54ACT2708FMQR | 54ACT2708LMQR | 74AC2708LCQR | 54AC2708FMQR | 54AC2708DMQR | |
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描述 | 74AC2708SCQR | 54AC2708LMQR | 74AC2708FCQR | 54ACT2708DMQR | 54ACT2708FMQR | 54ACT2708LMQR | 74AC2708LCQR | 54AC2708FMQR | 54AC2708DMQR |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | SOP, SOP28,.4 | QCCN, LCC28,.45SQ | DFP, FL28,.4 | DIP, DIP28,.6 | DFP, FL28,.4 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | DFP, FL28,.4 | DIP, DIP28,.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDSO-G28 | S-XQCC-N28 | R-XDFP-F28 | R-XDIP-T28 | R-XDFP-F28 | S-XQCC-N28 | S-XQCC-N28 | R-XDFP-F28 | R-XDIP-T28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
字数代码 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C |
组织 | 64X9 | 64X9 | 64X9 | 64X9 | 64X9 | 64X9 | 64X9 | 64X9 | 64X9 |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | SOP | QCCN | DFP | DIP | DFP | QCCN | QCCN | DFP | DIP |
封装等效代码 | SOP28,.4 | LCC28,.45SQ | FL28,.4 | DIP28,.6 | FL28,.4 | LCC28,.45SQ | LCC28,.45SQ | FL28,.4 | DIP28,.6 |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | CHIP CARRIER | FLATPACK | IN-LINE | FLATPACK | CHIP CARRIER | CHIP CARRIER | FLATPACK | IN-LINE |
电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V | 5 V | 5 V | 5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
表面贴装 | YES | YES | YES | NO | YES | YES | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | NO LEAD | FLAT | THROUGH-HOLE | FLAT | NO LEAD | NO LEAD | FLAT | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL |
最大时钟频率 (fCLK) | 30 MHz | 20 MHz | 30 MHz | - | - | - | 30 MHz | 20 MHz | 20 MHz |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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