`*Customer :
SPECIFICATION
ITEM
MODEL
PART NO.
FLASH LED DEVICE
SSC-ZCWT824K
Rev 0.0
[
Contents]
1. Features -------------------------------------------------------------------------- 2
2. Absolute Maximum Ratings ------------------------------------------------- 2
3. Electro-optical Characteristics ----------------------------------------------- 2
4. CIE Chromaticity Diagram ------------------------------------------------- 3
5. Characteristic Diagram -------------------------------------------------------- 4
6. Soldering Profile --------------------------------------------------------------- 5
7. Outline Dimensions And Materials -------------------------------------- 6
8. Reel Dimensions --------------------------------------------------------------- 7
9. Reel Packing Structure ------------------------------------------------------ 8
10. Lot Number --------------------------------------------------------------------- 9
11. Precaution for Use ------------------------------------------------------------ 10
12.
Reliability- -------------------------------------------------------------- 11
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 1/11
1.Features
White colored SMT package
Suitable for all SMT assembly methods ; Suitable for all soldering methods
Applications :
•
Mobile Handset
•
Illumination
2. Absolute Maximum Ratings
*1
Parameter
Power Dissipation
Forward Current
Peak Forward Current (per die)
Reverse Voltage (per die)
LED Junction Temperature
Operating Temperature
Storage Temperature
Symbol
P
d
I
F
I
FM
V
R
T
j
T
opr
T
stg
*2
(T
a
=25ºC)
Value
333
90
100
5
125
-30 ~ +85
-40 ~ +100
Unit
mW
mA
mA
V
ºC
ºC
ºC
*1
Care is to be taken that Power Dissipation does not exceed the Absolute Maximum Rating of the product.
*2 I
FM
conditions is Pulse width Tw≤ 0.1ms, Duty ratio≤ 1/10.
3. Electro-Optical Characteristics
(T
a
=25ºC)
Parameter
Forward Voltage (per die)
Reverse Current (per die)
Luminous Intensity
*1
Peak Luminous Intensity vs.
Drive Current (Flash Mode)
*2
Illumination
*3
Viewing Angle
*4
Color Rendering Index
Chromaticity Coordinates
lx
2
θ
1/2
CRI
X
Y
Symbol
V
F
I
R
I
V
Condition
I
F
= 30 mA
V
R
= 5V
I
F
= 90 mA
I
F
= 170 mA
I
F
= 170 mA
I
F
= 90 mA
I
F
= 90 mA
I
F
= 90 mA
I
F
= 90 mA
-
88
0.283
0.295
Min
2.9
-
-
Typ
3.3
-
4
7
28
120
94
0.31
0.31
Max
3.9
100
7
10
33
-
96
0.330
0.339
cd
lux
deg.
r
-
-
Unit
V
µA
*1 The luminous intensity
I
V
is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
Luminous Intensity Measurement allowance is
±
10%.
*2 Flash mode condition is Pulse width Tw = 1sec, Duty ratio = 2 / 5
*3
θ
1/2
is
the off-axis where the luminous intensity is 1/2 of the peak intensity.
Note : All measurements were made under the standardized environment of SSC
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 2/11
4. CIE Chromaticity Diagram
ICI Chromaticity Diagram
0.9
0.8
0.7
0.6
0.5
Y
0.4
d
0.3
a
b
c
0.2
0.1
0.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
X
BIN
A
B
C
D
x
y
x
y
x
y
x
y
0.271
0.284
0.283
0.305
0.287
0.295
0.330
0.360
±0.01
Chromaticity Coordinates
0.285
0.259
0.287
0.295
0.296
0.276
0.330
0.318
0.296
0.276
0.330
0.339
0.330
0.318
0.344
0.335
0.283
0.305
0.330
0.360
0.330
0.339
0.346
0.374
*Color Coordinates Measurement allowance is
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 3/11
5. Characteristic Diagram
◎
Forward Voltage vs.
Forward Current (per die)
4.0
3.8
◎
Forward Current vs.
Relative Intensity
300
250
Forward Voltage V
F
[V]
3.6
3.4
3.2
3.0
2.8
2.6
Relative intensity[%]
0
10
20
30
40
50
60
200
150
100
50
0
Forward Current I
F
[mA]
0
30
60
90
120
150
180
210
240
◎
Ambient Temperature vs.
Allowable Forward Current
35
30
Forward Current I
F
[mA]
◎
Radiation Diagram
0
-30
30
Forward current I
F
(mA)
25
20
15
10
-60
60
5
0
-90
90
-25
0
25
50
75
100
Ambient temperature Ta(? )
◎
Spectrum
1.0
0.8
Normalized Intensity
0.6
0.4
0.2
0.0
400
500
600
700
Wavelength(nm)
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 4/11
6. Soldering Profile
The LED can be soldered in place using the reflow soldering method.
(1) Lead solder
Preliminary heating to be at maximum 210°C for maximum 2 minutes.
Soldering heat to be at maximum 240°C for maximum 10 seconds.
280
Device Surface Temperature [ C]
240
200
160
120
80
40
0
o
0
15
30
45
60
75
90
105 120 135 150 165 180 195
(2) Lead-free solder
Soldering Times [sec]
Preliminary heating to be at maximum 220°C for maximum 2 minutes.
Soldering heat to be at maximum 260°C for maximum 10 seconds.
280
Device Surface Temperature [ C]
240
200
160
120
80
40
0
0
15
30
45
60
75
90
105 120 135 150 165 180 195
o
Soldering Times [sec]
(3) Hand Soldering conditions
Not more than 5 seconds @MAX300°C, under Soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 5/11
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
