IC,BATTERY MANAGEMENT,LLCC,16PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 包装说明 | QFN-16 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | S-PQCC-N16 |
| 湿度敏感等级 | 3 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCN |
| 封装等效代码 | LCC16,.2SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 4.3/10 V |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| ISL6291-2CRZ-T | ISL6291-2CR | ISL6291-2CR-T | ISL6291-1CR-T | |
|---|---|---|---|---|
| 描述 | IC,BATTERY MANAGEMENT,LLCC,16PIN,PLASTIC | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PQCC16, 5 X 5 MM, THERMALLY ENHANCED, PLASTIC, MO-220VHHB, QFN-16 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PQCC16, 5 X 5 MM, THERMALLY ENHANCED, PLASTIC, MO-220VHHB, QFN-16 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PQCC16, 5 X 5 MM, THERMALLY ENHANCED, PLASTIC, MO-220VHHB, QFN-16 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QFN-16 | 5 X 5 MM, THERMALLY ENHANCED, PLASTIC, MO-220VHHB, QFN-16 | 5 X 5 MM, THERMALLY ENHANCED, PLASTIC, MO-220VHHB, QFN-16 | 5 X 5 MM, THERMALLY ENHANCED, PLASTIC, MO-220VHHB, QFN-16 |
| Reach Compliance Code | unknown | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | S-PQCC-N16 | S-PQCC-N16 | S-PQCC-N16 | S-PQCC-N16 |
| 湿度敏感等级 | 3 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | - | -20 °C | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | LCC16,.2SQ,32 | LCC16,.2SQ,32 | LCC16,.2SQ,32 | LCC16,.2SQ,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 电源 | 4.3/10 V | 4.3/10 V | 4.3/10 V | 4.3/10 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 厂商名称 | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | - | QFN | QFN | QFN |
| 针数 | - | 16 | 16 | 16 |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 |
| 可调阈值 | - | YES | YES | YES |
| 模拟集成电路 - 其他类型 | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-609代码 | - | e0 | e0 | e0 |
| 长度 | - | 5 mm | 5 mm | 5 mm |
| 信道数量 | - | 1 | 1 | 1 |
| 功能数量 | - | 1 | 1 | 1 |
| 峰值回流温度（摄氏度） | - | 240 | 240 | 240 |
| 座面最大高度 | - | 1 mm | 1 mm | 1 mm |
| 最大供电电压 (Vsup) | - | 10 V | 10 V | 10 V |
| 最小供电电压 (Vsup) | - | 4.35 V | 4.35 V | 4.35 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 5 mm | 5 mm | 5 mm |
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