Datasheet> 器件分类 > 模拟混合信号IC> 放大器电路> CMP01CZ

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CMP01CZ: 产品描述IC COMPARATOR, 3500 uV OFFSET-MAX, 110 ns RESPONSE TIME, CDIP8, MINI, HERMETIC SEALED, CERDIP-8, Comparator; 产品类别模拟混合信号IC 放大器电路; 文件大小2MB，共8页; 制造商ADI(亚德诺半导体); 官网地址https://www.analog.com; 标准

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CMP01CZ概述

IC COMPARATOR, 3500 uV OFFSET-MAX, 110 ns RESPONSE TIME, CDIP8, MINI, HERMETIC SEALED, CERDIP-8, Comparator

CMP01CZ规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	不符合
零件包装代码	DIP
包装说明	MINI, HERMETIC SEALED, CERDIP-8
针数	8
Reach Compliance Code	not_compliant
ECCN代码	EAR99
放大器类型	COMPARATOR
最大平均偏置电流 (IIB)	0.9 µA
25C 时的最大偏置电流 (IIB)	0.9 µA
最大输入失调电压	3500 µV
JESD-30 代码	R-GDIP-T8
JESD-609代码	e0
负供电电压上限	-18 V
标称负供电电压 (Vsup)	-15 V
功能数量	1
端子数量	8
最高工作温度	70 °C
最低工作温度
输出类型	TOTEM POLE
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DIP
封装等效代码	DIP8,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	5/+-15 V
认证状态	Not Qualified
标称响应时间	110 ns
座面最大高度	5.08 mm
最大压摆率	8.5 mA
供电电压上限	18 V
标称供电电压 (Vsup)	15 V
表面贴装	NO
技术	BIPOLAR
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	7.62 mm
Base Number Matches	1

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CMP01CZ相似产品对比

	CMP01CZ	CMP01EZ/883	CMP01Z/883	CMP01CP	CMP01J	CMP01CJ	CMP01EP	CMP01EZ	CMP01EJ
描述	IC COMPARATOR, 3500 uV OFFSET-MAX, 110 ns RESPONSE TIME, CDIP8, MINI, HERMETIC SEALED, CERDIP-8, Comparator	COMPARATOR, 1400uV OFFSET-MAX, 150ns RESPONSE TIME, CDIP8, HERMETRIC SEALED, CERAMIC, DIP-8	IC COMPARATOR, 1600 uV OFFSET-MAX, 110 ns RESPONSE TIME, CDIP8, MINI, HERMETIC SEALED, CERDIP-8, Comparator	IC COMPARATOR, 3500 uV OFFSET-MAX, 110 ns RESPONSE TIME, PDIP8, MINI, PLASTIC, DIP-8, Comparator	IC COMPARATOR, 1600 uV OFFSET-MAX, 110 ns RESPONSE TIME, MBCY8, TO-99, 8 PIN, Comparator	IC COMPARATOR, 3500 uV OFFSET-MAX, 110 ns RESPONSE TIME, MBCY8, TO-99, 8 PIN, Comparator	IC COMPARATOR, 1400 uV OFFSET-MAX, 110 ns RESPONSE TIME, PDIP8, MINI, PLASTIC, DIP-8, Comparator	COMPARATOR, 1400uV OFFSET-MAX, 110ns RESPONSE TIME, CDIP8, MINI, HERMETIC SEALED, CERDIP-8	IC COMPARATOR, 1400 uV OFFSET-MAX, 110 ns RESPONSE TIME, MBCY8, TO-99, 8 PIN, Comparator
包装说明	MINI, HERMETIC SEALED, CERDIP-8	DIP,	MINI, HERMETIC SEALED, CERDIP-8	MINI, PLASTIC, DIP-8	TO-99, 8 PIN	TO-99, 8 PIN	DIP, DIP8,.3	DIP, DIP8,.3	TO-99, 8 PIN
Reach Compliance Code	not_compliant	unknown	compliant	not_compliant	unknown	unknown	not_compliant	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
放大器类型	COMPARATOR	COMPARATOR	COMPARATOR	COMPARATOR	COMPARATOR	COMPARATOR	COMPARATOR	COMPARATOR	COMPARATOR
最大平均偏置电流 (IIB)	0.9 µA	0.6 µA	0.6 µA	0.9 µA	0.6 µA	0.9 µA	0.6 µA	0.6 µA	0.6 µA
最大输入失调电压	3500 µV	1400 µV	1600 µV	3500 µV	1600 µV	3500 µV	1400 µV	1400 µV	1400 µV
JESD-30 代码	R-GDIP-T8	R-CDIP-T8	R-GDIP-T8	R-PDIP-T8	O-MBCY-W8	O-MBCY-W8	R-PDIP-T8	R-GDIP-T8	O-MBCY-W8
负供电电压上限	-18 V	-18 V	-18 V	-18 V	-18 V	-18 V	-18 V	-18 V	-18 V
标称负供电电压 (Vsup)	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V
功能数量	1	1	1	1	1	1	1	1	1
端子数量	8	8	8	8	8	8	8	8	8
最高工作温度	70 °C	70 °C	125 °C	70 °C	125 °C	70 °C	70 °C	70 °C	70 °C
输出类型	TOTEM POLE	TOTEM POLE	TOTEM POLE	TOTEM POLE	TOTEM POLE	TOTEM POLE	TOTEM POLE	TOTEM POLE	TOTEM POLE
封装主体材料	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	METAL	METAL	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	METAL
封装代码	DIP	DIP	DIP	DIP	TO-99	TO-99	DIP	DIP	TO-99
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	ROUND	ROUND	RECTANGULAR	RECTANGULAR	ROUND
封装形式	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CYLINDRICAL	CYLINDRICAL	IN-LINE	IN-LINE	CYLINDRICAL
标称响应时间	110 ns	150 ns	110 ns	110 ns	110 ns	110 ns	110 ns	110 ns	110 ns
供电电压上限	18 V	18 V	18 V	18 V	18 V	18 V	18 V	18 V	18 V
标称供电电压 (Vsup)	15 V	15 V	15 V	15 V	15 V	15 V	15 V	15 V	15 V
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
温度等级	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	WIRE	WIRE	THROUGH-HOLE	THROUGH-HOLE	WIRE
端子位置	DUAL	DUAL	DUAL	DUAL	BOTTOM	BOTTOM	DUAL	DUAL	BOTTOM
是否无铅	不含铅	-	含铅	含铅	含铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	-	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	DIP	-	DIP	DIP	TO-99	TO-99	DIP	DIP	TO-99
针数	8	-	8	8	8	8	8	8	8
25C 时的最大偏置电流 (IIB)	0.9 µA	-	-	0.9 µA	0.6 µA	0.9 µA	0.6 µA	0.6 µA	0.6 µA
JESD-609代码	e0	-	-	e0	e0	e0	e0	e0	e0
封装等效代码	DIP8,.3	-	-	DIP8,.3	CAN8,.2	CAN8,.2	DIP8,.3	DIP8,.3	CAN8,.2
峰值回流温度（摄氏度）	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	5/+-15 V	-	-	5/+-15 V	5/+-15 V	5/+-15 V	5/+-15 V	5/+-15 V	5/+-15 V
认证状态	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	5.08 mm	-	5.08 mm	5.33 mm	-	-	5.33 mm	5.08 mm	-
最大压摆率	8.5 mA	-	-	8.5 mA	8 mA	8.5 mA	8 mA	8 mA	8 mA
端子面层	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子节距	2.54 mm	-	2.54 mm	2.54 mm	-	-	2.54 mm	2.54 mm	-
处于峰值回流温度下的最长时间	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	7.62 mm	-	7.62 mm	7.62 mm	-	-	7.62 mm	7.62 mm	-
厂商名称	-	-	-	ADI(亚德诺半导体)	ADI(亚德诺半导体)	ADI(亚德诺半导体)	ADI(亚德诺半导体)	ADI(亚德诺半导体)	ADI(亚德诺半导体)

CMP01CZ

CMP01CZ概述

CMP01CZ规格参数

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