Ball / Land Grid Array Sockets
Screw Lock Type
EP patents 0829188, 0897655
Patents pending in other countries.
E-tec
the Swiss connection
E-tec is now the leading BGA socket manufacturer.
Sockets range from 5 x 5 upwards contacts with even larger parts
currently in design. Some of the existing patterns are shown on the
following pages, many more exist and your exact requirements can easily
be added to our extensive product library. The SMD socket is simply
placed and reflowed onto the PCB in the same way as the chip and
occupies only a small amount of additional board space. The screw lock
socket extends
≈
6,00 mm beyond the outer ballrow with no fixing holes.
We aim to solve your requirements - many different terminals and
configurations are available. Your custom sets our standards!
Please note, we will always request the chip data
to ensure we offer a compatible socket.
SMT Style
PCB Pad Layout
Ø 0,70mm/.028“ if pitch 1,27mm
Ø 0,60mm/.023“ if pitch 1,00mm
Ø 0,50mm/.019“ if pitch 0,80mm
dimensions if BGA Socket pitch 1,27mm with contact type 30
Soldertail Style
Soldertail:
Ø 0,45mm/.017“ if pitch 1,27mm
Ø 0,45mm/.017“ if pitch 1,00mm
Ø 0,40mm/.015“ if pitch 0,80mm
Specifications
Mechanical data
Contact life
Retention System life
Solderability
Individual contact force
Max. torque for retention screws
100000 cycles min.
100 cycles min.
exceeds MIL-STD-202 Method 208
40 grams max.
7 cN per meter, or 10oz per inch
Glass Epoxy FR 4
Brass
BeCu
< 30 m
Ω
1 A max.
>10
4
MΩ
1 KV min.
< 5 nH
−55°C
to
+130°C
; 220°C for 10 sec.
PCB Hole Layaut
PCB Hole:
Ø 0,60mm/.024“ if pitch 1,27mm
Ø 0,60mm/.024“ if pitch 1,00mm
Ø 0,55mm/.021“ if pitch 0,80mm
Material
Insulator
Terminal
Contact
Electrical data
Contact resistance
Current rating
Insulation resistance at 500V DC
Breakdown voltage at 60 Hz
Inductance
The pitch dimension depends on your Ball Grid Array
Operating temperature
How to order
X X W xxxx - xx xx - xx XX xx
Device Type
B
= Ball Grid
L
= Land Grid
C
= Column Grid
Device Material
C
P
=
=
Ceramic
Plastic
Pitch
07
08
10
12
15
=
=
=
=
=
0,75mm
0,80mm
1,00mm
1,27mm
1,50mm
Grid Code Config Code
please refer to
the footprint
pages
42 to 50
will be given by
the factory after
receipt of the chip
datasheet
Plating
01
= tin/gold
Nbr of contacts
refer to the next pages
Contact Type
30
= standard SMD
29
= raised SMD
70
= solder tail
( „A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm & 0,80mm pitch )
( „A“ = 5,00mm; other dim. on request )
( „A“ = 3,30mm if 1,27mm pitch; 2,80mm if 1,00mm & 0,80mm pitch )
38
FPGA/CPLD
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