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MRFIC1814R2

产品描述TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDSO16, PLASTIC, TSSOP-16
产品类别无线/射频/通信    电信电路   
文件大小392KB,共8页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
下载文档 详细参数 选型对比 全文预览

MRFIC1814R2概述

TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDSO16, PLASTIC, TSSOP-16

MRFIC1814R2规格参数

参数名称属性值
厂商名称NXP(恩智浦)
零件包装代码TSSOP
包装说明TSSOP,
针数16
Reach Compliance Codeunknown
ECCN代码EAR99
JESD-30 代码R-PDSO-G16
功能数量1
端子数量16
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
认证状态Not Qualified
座面最大高度1.2 mm
标称供电电压3 V
表面贴装YES
电信集成电路类型RF AND BASEBAND CIRCUIT
温度等级INDUSTRIAL
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
宽度4.4 mm
Base Number Matches1

文档预览

下载PDF文档
Freescale Semiconductor, Inc.
this document by MRFIC1814/D
Order
MRFIC1814
1.9 GHz GaAs Downconverter
Designed primarily for use in wireless Personal Communication Systems
(PCS) applications such as Digital European Cordless Telephone (DECT),
Japan’s Personal Handy System (PHS), and the emerging North American
systems. The MRFIC1814 includes a low noise amplifier and downmixer in a
low-cost TSSOP–16 package. The integrated circuit requires minimal
off-chip matching while allowing for the maximum in flexibility and efficiency.
The mixer is optimized for low–side injection and offers reasonable intercept
point as well as high efficiency with 8.0 dB of conversion gain. Image filtering
is implemented off-chip to allow maximum flexibility. CMOS compatible
ENABLE pins allow standby operation where the current drain is less than
0.1 mA.
Together with the rest of the MRFIC18XX series, this GaAs IC family
offers the complete transmit and receive functions, less LO and filters,
needed for a typical 1.8 GHz cordless telephone.
Usable Frequency Range = 1.8 to 2.0 GHz
1.8 GHz LOW NOISE
AMPLIFIER AND DOWNMIXER
SEMICONDUCTOR
TECHNICAL DATA
ARCHIVE INFORMATION
Freescale Semiconductor, Inc...
17 dB Typ Gain, 2.5 dB Typ Noise Figure LNA
8.0 dB Typ Gain, 10 dB Typ Noise Figure Mixer
–5.5 dBm Typ Mixer Input Intercept Point
Simple LO/IF Off-chip Matching for Maximum Flexibility
Low Power Consumption = 39 mW (Typ)
Single Bias Supply = 2.7 to 4.5 V
Low LO Power Requirement = –5.0 dBm (Typ)
Low Cost Surface Mount Plastic Package
16
1
PLASTIC PACKAGE
CASE 948C
(TSSOP–16)
PIN CONNECTIONS
Mixer Enable
N.C.
1
2
3
4
5
6
7
8
(Top View)
16
15
14
13
12
11
10
9
IF Out/VDD3
N.C.
Mixer In
Gnd
VDD1
Gnd
Gnd
LNA In
Functional Block Diagram
LO Input
VDD2
IF Out/VDD3
LNA Out
LNA Cap
N.C.
LO Input
Mixer In
LNA Enable
Mixer
LNA Out
LNA
LNA In
Device
ORDERING INFORMATION
Operating
Temperature Range
TA = – 40° to +85°C
Package
TSSOP–16
TSSOP–16
Tape & Reel*
MRFIC1814
MRFIC1814R2
*2,500 Units per 16 mm, 13 inch reel.
©
Motorola, Inc. 1999
Rev 3
MOTOROLA RF/IF DEVICE DATA
For More Information On This Product,
1
Go to: www.freescale.com
ARCHIVE INFORMATION

MRFIC1814R2相似产品对比

MRFIC1814R2 MRFIC1814
描述 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDSO16, PLASTIC, TSSOP-16 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDSO16, PLASTIC, TSSOP-16
厂商名称 NXP(恩智浦) NXP(恩智浦)
零件包装代码 TSSOP TSSOP
包装说明 TSSOP, TSSOP,
针数 16 16
Reach Compliance Code unknown unknown
JESD-30 代码 R-PDSO-G16 R-PDSO-G16
功能数量 1 1
端子数量 16 16
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSSOP
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
认证状态 Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm
标称供电电压 3 V 3 V
表面贴装 YES YES
电信集成电路类型 RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT
温度等级 INDUSTRIAL INDUSTRIAL
端子形式 GULL WING GULL WING
端子节距 0.65 mm 0.65 mm
端子位置 DUAL DUAL
宽度 4.4 mm 4.4 mm
Base Number Matches 1 1
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