SN74HC09NP3
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | DIP, DIP14,.3 |
Reach Compliance Code | not_compliant |
JESD-30 代码 | R-PDIP-T14 |
逻辑集成电路类型 | AND GATE |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | OPEN-DRAIN |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 2/6 V |
施密特触发器 | NO |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
SN74HC09NP3 | SN74HC09FHP4 | SN74HC09FN3 | SN74HC09FH4 | SN74HC09JP4 | SN74HC09N3 | SN74HC09J4 | SN74HC09FH | SN74HC09J | SN74HC09FN | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | SN74HC09NP3 | SN74HC09FHP4 | SN74HC09FN3 | SN74HC09FH4 | SN74HC09JP4 | SN74HC09N3 | SN74HC09J4 | IC,LOGIC GATE,QUAD 2-INPUT AND,HC-CMOS,LLCC,20PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT AND,HC-CMOS,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT AND,HC-CMOS,LDCC,20PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | DIP, DIP14,.3 | QCCN, LCC20,.35SQ | QCCJ, LDCC20,.4SQ | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | QCCJ, LDCC20,.4SQ |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
JESD-30 代码 | R-PDIP-T14 | S-XQCC-N20 | S-PQCC-J20 | S-XQCC-N20 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | S-XQCC-N20 | R-XDIP-T14 | S-PQCC-J20 |
逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
端子数量 | 14 | 20 | 20 | 20 | 14 | 14 | 14 | 20 | 14 | 20 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
封装代码 | DIP | QCCN | QCCJ | QCCN | DIP | DIP | DIP | QCCN | DIP | QCCJ |
封装等效代码 | DIP14,.3 | LCC20,.35SQ | LDCC20,.4SQ | LCC20,.35SQ | DIP14,.3 | DIP14,.3 | DIP14,.3 | LCC20,.35SQ | DIP14,.3 | LDCC20,.4SQ |
封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
施密特触发器 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
表面贴装 | NO | YES | YES | YES | NO | NO | NO | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | THROUGH-HOLE | NO LEAD | J BEND | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | J BEND |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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