IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, HERMETIC SEALED, CERDIP-16, Multiplexer or Switch
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | DIP |
包装说明 | HERMETIC SEALED, CERDIP-16 |
针数 | 16 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
模拟集成电路 - 其他类型 | SPST |
JESD-30 代码 | R-GDIP-T16 |
JESD-609代码 | e0 |
长度 | 19.05 mm |
标称负供电电压 (Vsup) | -15 V |
正常位置 | NC |
信道数量 | 1 |
功能数量 | 4 |
端子数量 | 16 |
标称断态隔离度 | 66 dB |
通态电阻匹配规范 | 1.2 Ω |
最大通态电阻 (Ron) | 100 Ω |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出 | SEPARATE OUTPUT |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | +-15 V |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大供电电流 (Isup) | 9 mA |
标称供电电压 (Vsup) | 15 V |
表面贴装 | NO |
最长断开时间 | 450 ns |
最长接通时间 | 550 ns |
切换 | BREAK-BEFORE-MAKE |
技术 | JFET |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
Base Number Matches | 1 |
SW-7511BQ | SW-7511EQ | SW-7511FQ | SW-7510FQ | SW-7510EQ | SW-7511AQ | SW-7511BQ/883 | SW-7511AQ/883 | |
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描述 | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, HERMETIC SEALED, CERDIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, HERMETIC SEALED, CERDIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, HERMETIC SEALED, CERDIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, HERMETIC SEALED, CERDIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, HERMETIC SEALED, CERDIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, HERMETIC SEALED, CERDIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, HERMETIC SEALED, CERDIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, HERMETIC SEALED, CERDIP-16, Multiplexer or Switch |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
包装说明 | HERMETIC SEALED, CERDIP-16 | HERMETIC SEALED, CERDIP-16 | HERMETIC SEALED, CERDIP-16 | DIP, DIP16,.3 | DIP, DIP16,.3 | HERMETIC SEALED, CERDIP-16 | HERMETIC SEALED, CERDIP-16 | HERMETIC SEALED, CERDIP-16 |
针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | not_compliant | not_compliant | unknown | unknown | unknown | unknown | compliant | compliant |
模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST |
JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 19.05 mm | 19.05 mm | 19.05 mm | 19.05 mm | 19.05 mm | 19.05 mm | 19.05 mm | 19.05 mm |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
标称断态隔离度 | 66 dB | 66 dB | 66 dB | 66 dB | 66 dB | 66 dB | 66 dB | 66 dB |
通态电阻匹配规范 | 1.2 Ω | 0.9 Ω | 1.2 Ω | 1.2 Ω | 0.9 Ω | 0.9 Ω | 1.2 Ω | 0.9 Ω |
最大通态电阻 (Ron) | 100 Ω | 75 Ω | 100 Ω | 100 Ω | 75 Ω | 75 Ω | 100 Ω | 75 Ω |
最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -25 °C | -25 °C | -25 °C | -25 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
最大供电电流 (Isup) | 9 mA | 9 mA | 9 mA | 9 mA | 9 mA | 9 mA | 9 mA | 9 mA |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
最长断开时间 | 450 ns | 300 ns | 450 ns | 450 ns | 300 ns | 300 ns | 450 ns | 300 ns |
最长接通时间 | 550 ns | 450 ns | 550 ns | 550 ns | 450 ns | 450 ns | 550 ns | 450 ns |
技术 | JFET | JFET | JFET | JFET | JFET | JFET | JFET | JFET |
温度等级 | MILITARY | OTHER | OTHER | OTHER | OTHER | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - |
正常位置 | NC | NC | NC | NO | NO | NC | - | - |
输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | - | - |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | - | - |
电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | - | - |
切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | - |
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