General Purpose Inductor, 100uH, 30%, 2 Element, Iron-Core
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | EPCOS (TDK) |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 构造 | Cylindrical |
| 型芯材料 | IRON |
| 直流电阻 | 0.12 Ω |
| 标称电感 (L) | 100 µH |
| 电感器应用 | POWER INDUCTOR |
| 电感器类型 | GENERAL PURPOSE INDUCTOR |
| JESD-609代码 | e3 |
| 功能数量 | 2 |
| 端子数量 | 4 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装高度 | 25 mm |
| 封装长度 | 33.6 mm |
| 封装形式 | PCB Mount |
| 封装宽度 | 32.6 mm |
| 最大额定电流 | 3 A |
| 形状/尺寸说明 | CYLINDRICAL PACKAGE |
| 屏蔽 | NO |
| 表面贴装 | NO |
| 端子面层 | Tin (Sn) |
| 端子位置 | DUAL IN-LINE |
| 端子形状 | SOLID LEAD |
| 容差 | 30% |
| Base Number Matches | 1 |
| B82624-B2302-N1 | B82624-B2602-N1 | B82624-B2402-N1 | B82624-B2202-N1 | B82624-B2102-N1 | |
|---|---|---|---|---|---|
| 描述 | General Purpose Inductor, 100uH, 30%, 2 Element, Iron-Core | General Purpose Inductor, 25uH, 30%, 2 Element, Iron-Core | General Purpose Inductor, 50uH, 30%, 2 Element, Iron-Core | General Purpose Inductor, 200uH, 30%, 2 Element, Iron-Core | General Purpose Inductor, 800uH, 30%, 2 Element, Iron-Core |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 型芯材料 | IRON | IRON | IRON | IRON | IRON |
| 直流电阻 | 0.12 Ω | 0.035 Ω | 0.06 Ω | 0.25 Ω | 1 Ω |
| 标称电感 (L) | 100 µH | 25 µH | 50 µH | 200 µH | 800 µH |
| 电感器应用 | POWER INDUCTOR | POWER INDUCTOR | POWER INDUCTOR | POWER INDUCTOR | POWER INDUCTOR |
| 电感器类型 | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 4 | 4 | 4 | 4 | 4 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 最大额定电流 | 3 A | 6 A | 4 A | 2 A | 1 A |
| 形状/尺寸说明 | CYLINDRICAL PACKAGE | CYLINDRICAL PACKAGE | CYLINDRICAL PACKAGE | CYLINDRICAL PACKAGE | CYLINDRICAL PACKAGE |
| 屏蔽 | NO | NO | NO | NO | NO |
| 表面贴装 | NO | NO | NO | NO | NO |
| 端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| 端子位置 | DUAL IN-LINE | DUAL IN-LINE | DUAL IN-LINE | DUAL IN-LINE | DUAL IN-LINE |
| 端子形状 | SOLID LEAD | SOLID LEAD | SOLID LEAD | SOLID LEAD | SOLID LEAD |
| 容差 | 30% | 30% | 30% | 30% | 30% |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | EPCOS (TDK) | EPCOS (TDK) | EPCOS (TDK) | EPCOS (TDK) | - |
| 制造商序列号 | - | B82624 | B82624 | B82624 | B82624 |
工控电子
为我们提建议&公告
RF/无线
嵌入式系统
电源技术
PCB设计
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
