IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | DIE |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| 系列 | HCT |
| JESD-30 代码 | X-XUUC-N |
| 逻辑集成电路类型 | BUFFER |
| 功能数量 | 9 |
| 输入次数 | 1 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | OPEN-DRAIN |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | UNSPECIFIED |
| 封装形式 | UNCASED CHIP |
| 传播延迟（tpd） | 47 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| Base Number Matches | 1 |
| 933987880005 | 74HC9115U | 933987840118 | 933987840112 | 933987860112 | 933987870112 | 933987870118 | 933987850005 | 933987830112 | 74HCT9115U | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate | IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate | IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate | IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate | IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, PDIP20, DIP-20, Gate | IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate | IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate | IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate | IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, PDIP20, DIP-20, Gate | IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate |
| 零件包装代码 | DIE | DIE | SOIC | SOIC | DIP | SOIC | SOIC | DIE | DIP | DIE |
| 包装说明 | , | , | SO-20 | SO-20 | DIP, | SO-20 | SO-20 | , | DIP, | , |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | HCT | HC/UH | HC/UH | HC/UH | HCT | HCT | HCT | HC/UH | HC/UH | HCT |
| JESD-30 代码 | X-XUUC-N | X-XUUC-N | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | X-XUUC-N | R-PDIP-T20 | X-XUUC-N |
| 逻辑集成电路类型 | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
| 功能数量 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 输入次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED |
| 封装形状 | UNSPECIFIED | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | UNSPECIFIED |
| 封装形式 | UNCASED CHIP | UNCASED CHIP | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | UNCASED CHIP | IN-LINE | UNCASED CHIP |
| 传播延迟（tpd） | 47 ns | 165 ns | 165 ns | 165 ns | 47 ns | 47 ns | 47 ns | 165 ns | 165 ns | 47 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 6 V | 6 V | 6 V | 5.5 V | 5.5 V | 5.5 V | 6 V | 6 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 2 V | 2 V | 2 V | 4.5 V | 4.5 V | 4.5 V | 2 V | 2 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO | YES | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | NO LEAD | NO LEAD | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子位置 | UPPER | UPPER | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER | DUAL | UPPER |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 是否无铅 | - | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | - |
| 是否Rohs认证 | - | - | 符合 | 符合 | 符合 | 符合 | 符合 | - | 符合 | - |
| 针数 | - | - | 20 | 20 | 20 | 20 | 20 | - | 20 | - |
| JESD-609代码 | - | - | e4 | e4 | e4 | e4 | e4 | - | e4 | - |
| 长度 | - | - | 12.8 mm | 12.8 mm | 26.73 mm | 12.8 mm | 12.8 mm | - | 26.73 mm | - |
| 端子数量 | - | - | 20 | 20 | 20 | 20 | 20 | - | 20 | - |
| 封装代码 | - | - | SOP | SOP | DIP | SOP | SOP | - | DIP | - |
| 峰值回流温度（摄氏度） | - | - | 260 | 260 | 245 | 260 | 260 | - | 245 | - |
| 座面最大高度 | - | - | 2.65 mm | 2.65 mm | 4.2 mm | 2.65 mm | 2.65 mm | - | 4.2 mm | - |
| 端子面层 | - | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | - |
| 端子节距 | - | - | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | - | 2.54 mm | - |
| 处于峰值回流温度下的最长时间 | - | - | 40 | 40 | 40 | 30 | 40 | - | 40 | - |
| 宽度 | - | - | 7.5 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.5 mm | - | 7.62 mm | - |
嵌入式系统
传感器
嵌入式系统
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