AHC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 系列 | AHC |
| JESD-30 代码 | R-GDIP-T16 |
| 长度 | 19.56 mm |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| SN54AHC258J | SN74AHC258DGV | SN54AHC258FK | SN54AHC258W | SN74AHC258N | |
|---|---|---|---|---|---|
| 描述 | AHC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDIP16, CERAMIC, DIP-16 | AHC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, PLASTIC, TVSOP-16 | AHC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | AHC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDFP16, CERAMIC, FP-16 | AHC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDIP16, PLASTIC, DIP-16 |
| 零件包装代码 | DIP | SOIC | QLCC | DFP | DIP |
| 包装说明 | DIP, | TSSOP, | QCCN, | DFP, | DIP, DIP16,.3 |
| 针数 | 16 | 16 | 20 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | _compli |
| 系列 | AHC | AHC | AHC | AHC | AHC |
| JESD-30 代码 | R-GDIP-T16 | R-PDSO-G16 | S-CQCC-N20 | R-GDFP-F16 | R-PDIP-T16 |
| 长度 | 19.56 mm | 4.4 mm | 8.89 mm | 10.2 mm | 19.305 mm |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 20 | 16 | 16 |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | -55 °C | -55 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | TSSOP | QCCN | DFP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | FLATPACK | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 1.2 mm | 2.03 mm | 2.03 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | NO LEAD | FLAT | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 0.4 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 7.62 mm | 3.6 mm | 8.89 mm | 6.73 mm | 7.62 mm |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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