Fast Page DRAM, 256KX4, 80ns, CMOS, PDIP20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | FUJITSU(富士通) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP20,.3 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 80 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDIP-T20 |
| JESD-609代码 | e0 |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | FAST PAGE DRAM |
| 内存宽度 | 4 |
| 端子数量 | 20 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX4 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 512 |
| 最大待机电流 | 0.00025 A |
| 最大压摆率 | 0.062 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| MB81C4256A-80LP | MB81C4256A-70LPSZ | MB81C4256A-70LC | MB81C4256A-80LPFTN | MB81C4256A-80LPJ | MB81C4256A-70LPFTR | MB81C4256A-10LPJ | MB81C4256A-10LC | MB81C4256A-70LPFTN | MB81C4256A-80LPSZ | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM, 256KX4, 80ns, CMOS, PDIP20 | Fast Page DRAM, 256KX4, 70ns, CMOS, PZIP20, PLASTIC, ZIP-20 | Fast Page DRAM, 256KX4, 70ns, CMOS, CDIP20 | Fast Page DRAM, 256KX4, 80ns, CMOS, PDSO20 | Fast Page DRAM, 256KX4, 80ns, CMOS, PDSO20 | Fast Page DRAM, 256KX4, 70ns, CMOS, PDSO20 | Fast Page DRAM, 256KX4, 100ns, CMOS, PDSO20 | Fast Page DRAM, 256KX4, 100ns, CMOS, CDIP20 | Fast Page DRAM, 256KX4, 70ns, CMOS, PDSO20 | Fast Page DRAM, 256KX4, 80ns, CMOS, PZIP20 |
| 包装说明 | DIP, DIP20,.3 | ZIP, | DIP, DIP20,.3 | TSSOP, TSSOP20/24,.63,20 | SOJ, SOJ20/26,.34 | TSSOP, TSSOP20/24,.63,20 | SOJ, SOJ20/26,.34 | DIP, DIP20,.3 | TSSOP, TSSOP20/24,.63,20 | ZIP, ZIP20,.1 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| 最长访问时间 | 80 ns | 70 ns | 70 ns | 80 ns | 80 ns | 70 ns | 100 ns | 100 ns | 70 ns | 80 ns |
| JESD-30 代码 | R-PDIP-T20 | R-PZIP-T20 | R-XDIP-T20 | R-PDSO-G20 | R-PDSO-J20 | R-PDSO-G20 | R-PDSO-J20 | R-XDIP-T20 | R-PDSO-G20 | R-PZIP-T20 |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bi |
| 内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | ZIP | DIP | TSSOP | SOJ | TSSOP | SOJ | DIP | TSSOP | ZIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | YES | YES | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | J BEND | GULL WING | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 0.5 mm | 1.27 mm | 0.5 mm | 1.27 mm | 2.54 mm | 0.5 mm | 1.27 mm |
| 端子位置 | DUAL | ZIG-ZAG | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | ZIG-ZAG |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | FUJITSU(富士通) | - | FUJITSU(富士通) | - | FUJITSU(富士通) | - | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) |
| 零件包装代码 | DIP | - | DIP | SOIC | LCC | SOIC | LCC | DIP | SOIC | ZIP |
| 针数 | 20 | - | 20 | 20 | 26/20 | 20 | 26/20 | 20 | 20 | 20 |
| I/O 类型 | COMMON | - | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 封装等效代码 | DIP20,.3 | - | DIP20,.3 | TSSOP20/24,.63,20 | SOJ20/26,.34 | TSSOP20/24,.63,20 | SOJ20/26,.34 | DIP20,.3 | TSSOP20/24,.63,20 | ZIP20,.1 |
| 电源 | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大待机电流 | 0.00025 A | - | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A |
| 最大压摆率 | 0.062 mA | - | 0.068 mA | 0.062 mA | 0.062 mA | 0.068 mA | 0.054 mA | 0.054 mA | 0.068 mA | 0.062 mA |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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