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MB81C4256A-70LC: 产品描述Fast Page DRAM, 256KX4, 70ns, CMOS, CDIP20; 产品类别存储存储; 文件大小931KB，共25页; 制造商FUJITSU(富士通); 官网地址http://edevice.fujitsu.com/fmd/en/index.html

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MB81C4256A-70LC概述

Fast Page DRAM, 256KX4, 70ns, CMOS, CDIP20

MB81C4256A-70LC规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	FUJITSU(富士通)
零件包装代码	DIP
包装说明	DIP, DIP20,.3
针数	20
Reach Compliance Code	unknown
最长访问时间	70 ns
I/O 类型	COMMON
JESD-30 代码	R-XDIP-T20
JESD-609代码	e0
内存密度	1048576 bit
内存集成电路类型	FAST PAGE DRAM
内存宽度	4
端子数量	20
字数	262144 words
字数代码	256000
最高工作温度	70 °C
最低工作温度
组织	256KX4
输出特性	3-STATE
封装主体材料	CERAMIC
封装代码	DIP
封装等效代码	DIP20,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
电源	5 V
认证状态	Not Qualified
刷新周期	512
最大待机电流	0.00025 A
最大压摆率	0.068 mA
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
Base Number Matches	1

MB81C4256A-70LC相似产品对比

	MB81C4256A-70LC	MB81C4256A-70LPSZ	MB81C4256A-80LPFTN	MB81C4256A-80LP	MB81C4256A-80LPJ	MB81C4256A-70LPFTR	MB81C4256A-10LPJ	MB81C4256A-10LC	MB81C4256A-70LPFTN	MB81C4256A-80LPSZ
描述	Fast Page DRAM, 256KX4, 70ns, CMOS, CDIP20	Fast Page DRAM, 256KX4, 70ns, CMOS, PZIP20, PLASTIC, ZIP-20	Fast Page DRAM, 256KX4, 80ns, CMOS, PDSO20	Fast Page DRAM, 256KX4, 80ns, CMOS, PDIP20	Fast Page DRAM, 256KX4, 80ns, CMOS, PDSO20	Fast Page DRAM, 256KX4, 70ns, CMOS, PDSO20	Fast Page DRAM, 256KX4, 100ns, CMOS, PDSO20	Fast Page DRAM, 256KX4, 100ns, CMOS, CDIP20	Fast Page DRAM, 256KX4, 70ns, CMOS, PDSO20	Fast Page DRAM, 256KX4, 80ns, CMOS, PZIP20
包装说明	DIP, DIP20,.3	ZIP,	TSSOP, TSSOP20/24,.63,20	DIP, DIP20,.3	SOJ, SOJ20/26,.34	TSSOP, TSSOP20/24,.63,20	SOJ, SOJ20/26,.34	DIP, DIP20,.3	TSSOP, TSSOP20/24,.63,20	ZIP, ZIP20,.1
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
最长访问时间	70 ns	70 ns	80 ns	80 ns	80 ns	70 ns	100 ns	100 ns	70 ns	80 ns
JESD-30 代码	R-XDIP-T20	R-PZIP-T20	R-PDSO-G20	R-PDIP-T20	R-PDSO-J20	R-PDSO-G20	R-PDSO-J20	R-XDIP-T20	R-PDSO-G20	R-PZIP-T20
内存密度	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bi
内存集成电路类型	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM
内存宽度	4	4	4	4	4	4	4	4	4	4
端子数量	20	20	20	20	20	20	20	20	20	20
字数	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
字数代码	256000	256000	256000	256000	256000	256000	256000	256000	256000	256000
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIP	ZIP	TSSOP	DIP	SOJ	TSSOP	SOJ	DIP	TSSOP	ZIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	512	512	512	512	512	512	512	512	512	512
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	YES	NO	YES	YES	YES	NO	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	J BEND	GULL WING	J BEND	THROUGH-HOLE	GULL WING	THROUGH-HOLE
端子节距	2.54 mm	1.27 mm	0.5 mm	2.54 mm	1.27 mm	0.5 mm	1.27 mm	2.54 mm	0.5 mm	1.27 mm
端子位置	DUAL	ZIG-ZAG	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	ZIG-ZAG
是否Rohs认证	不符合	-	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	FUJITSU(富士通)	-	-	FUJITSU(富士通)	FUJITSU(富士通)	-	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)
零件包装代码	DIP	-	SOIC	DIP	LCC	SOIC	LCC	DIP	SOIC	ZIP
针数	20	-	20	20	26/20	20	26/20	20	20	20
I/O 类型	COMMON	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-609代码	e0	-	e0	e0	e0	e0	e0	e0	e0	e0
封装等效代码	DIP20,.3	-	TSSOP20/24,.63,20	DIP20,.3	SOJ20/26,.34	TSSOP20/24,.63,20	SOJ20/26,.34	DIP20,.3	TSSOP20/24,.63,20	ZIP20,.1
电源	5 V	-	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
最大待机电流	0.00025 A	-	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A	0.00025 A
最大压摆率	0.068 mA	-	0.062 mA	0.062 mA	0.062 mA	0.068 mA	0.054 mA	0.054 mA	0.068 mA	0.062 mA
端子面层	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

MB81C4256A-70LC

MB81C4256A-70LC概述

MB81C4256A-70LC规格参数

MB81C4256A-70LC相似产品对比

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