IC 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PDIP42, 0.600 INCH, PLASTIC, SDIP-42, Microcontroller
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | DIP |
包装说明 | SDIP, SDIP42,.6 |
针数 | 42 |
Reach Compliance Code | unknown |
具有ADC | YES |
地址总线宽度 | |
位大小 | 8 |
CPU系列 | 8051 |
最大时钟频率 | 12 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | R-PDIP-T42 |
JESD-609代码 | e3/e4 |
长度 | 38.65 mm |
I/O 线路数量 | 28 |
端子数量 | 42 |
最高工作温度 | 70 °C |
最低工作温度 | -20 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SDIP |
封装等效代码 | SDIP42,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE, SHRINK PITCH |
电源 | 5 V |
认证状态 | Not Qualified |
RAM(字节) | 768 |
ROM(单词) | 32768 |
ROM可编程性 | MROM |
座面最大高度 | 5.08 mm |
速度 | 12 MHz |
最大压摆率 | 32 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN/NICKEL PALLADIUM GOLD |
端子形式 | THROUGH-HOLE |
端子节距 | 1.778 mm |
端子位置 | DUAL |
宽度 | 15.24 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
Base Number Matches | 1 |
P83C366BDR | P87C766BDR | P87C766CBA | P87C766CBP | P83C266BDR | P83C366CBP | P83C366BDA | |
---|---|---|---|---|---|---|---|
描述 | IC 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PDIP42, 0.600 INCH, PLASTIC, SDIP-42, Microcontroller | IC 8-BIT, OTPROM, 12 MHz, MICROCONTROLLER, PDIP42, 0.600 INCH, PLASTIC, SDIP-42, Microcontroller | IC 8-BIT, OTPROM, 12 MHz, MICROCONTROLLER, PQCC68, PLASTIC, MO-047AC, SOT-188-2, LCC-68, Microcontroller | IC 8-BIT, OTPROM, 12 MHz, MICROCONTROLLER, PDIP42, 0.600 INCH, PLASTIC, SDIP-42, Microcontroller | IC 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PDIP42, 0.600 INCH, PLASTIC, SDIP-42, Microcontroller | IC 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PDIP42, 0.600 INCH, PLASTIC, SDIP-42, Microcontroller | IC 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PQCC68, PLASTIC, MO-047AC, SOT-188-2, LCC-68, Microcontroller |
零件包装代码 | DIP | DIP | LCC | DIP | DIP | DIP | LCC |
包装说明 | SDIP, SDIP42,.6 | 0.600 INCH, PLASTIC, SDIP-42 | PLASTIC, MO-047AC, SOT-188-2, LCC-68 | 0.600 INCH, PLASTIC, SDIP-42 | SDIP, SDIP42,.6 | 0.600 INCH, PLASTIC, SDIP-42 | PLASTIC, MO-047AC, SOT-188-2, LCC-68 |
针数 | 42 | 42 | 68 | 42 | 42 | 42 | 68 |
Reach Compliance Code | unknown | unknown | compliant | compliant | unknown | compliant | compliant |
具有ADC | YES | YES | YES | YES | YES | YES | YES |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
CPU系列 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
最大时钟频率 | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | R-PDIP-T42 | R-PDIP-T42 | S-PQCC-J68 | R-PDIP-T42 | R-PDIP-T42 | R-PDIP-T42 | S-PQCC-J68 |
长度 | 38.65 mm | 38.65 mm | 24.23 mm | 38.65 mm | 38.65 mm | 38.65 mm | 24.23 mm |
I/O 线路数量 | 28 | 28 | 36 | 28 | 28 | 28 | 36 |
端子数量 | 42 | 42 | 68 | 42 | 42 | 42 | 68 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
PWM 通道 | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SDIP | SDIP | QCCJ | SDIP | SDIP | SDIP | QCCJ |
封装等效代码 | SDIP42,.6 | SDIP42,.6 | LDCC68,1.0SQ | SDIP42,.6 | SDIP42,.6 | SDIP42,.6 | LDCC68,1.0SQ |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | CHIP CARRIER | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | CHIP CARRIER |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 768 | 3840 | 3840 | 3840 | 768 | 768 | 768 |
ROM(单词) | 32768 | 65536 | 65536 | 65536 | 24576 | 32768 | 32768 |
ROM可编程性 | MROM | OTPROM | OTPROM | OTPROM | MROM | MROM | MROM |
座面最大高度 | 5.08 mm | 5.08 mm | 4.57 mm | 5.08 mm | 5.08 mm | 5.08 mm | 4.57 mm |
速度 | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
最大压摆率 | 32 mA | 32 mA | 37 mA | 37 mA | 32 mA | 37 mA | 37 mA |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | NO | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
端子节距 | 1.778 mm | 1.778 mm | 1.27 mm | 1.778 mm | 1.778 mm | 1.778 mm | 1.27 mm |
端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD |
宽度 | 15.24 mm | 15.24 mm | 24.23 mm | 15.24 mm | 15.24 mm | 15.24 mm | 24.23 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
厂商名称 | NXP(恩智浦) | - | - | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
JESD-609代码 | e3/e4 | - | - | e3/e4 | e3/e4 | e3/e4 | - |
端子面层 | TIN/NICKEL PALLADIUM GOLD | - | - | TIN/NICKEL PALLADIUM GOLD | TIN/NICKEL PALLADIUM GOLD | TIN/NICKEL PALLADIUM GOLD | - |
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