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MX29F001BTC-12

产品描述Flash, 128KX8, 120ns, PDSO32, 8 X 20 MM, PLASTIC, MO-142, TSOP1-32
产品类别存储    存储   
文件大小588KB,共42页
制造商Macronix
官网地址http://www.macronix.com/en-us/Pages/default.aspx
下载文档 详细参数 选型对比 全文预览

MX29F001BTC-12概述

Flash, 128KX8, 120ns, PDSO32, 8 X 20 MM, PLASTIC, MO-142, TSOP1-32

MX29F001BTC-12规格参数

参数名称属性值
是否Rohs认证不符合
零件包装代码TSOP1
包装说明8 X 20 MM, PLASTIC, MO-142, TSOP1-32
针数32
Reach Compliance Codeunknown
ECCN代码EAR99
最长访问时间120 ns
启动块BOTTOM
命令用户界面YES
数据轮询YES
JESD-30 代码R-PDSO-G32
JESD-609代码e0
长度18.4 mm
内存密度1048576 bit
内存集成电路类型FLASH
内存宽度8
功能数量1
部门数/规模1,2,2,1,1
端子数量32
字数131072 words
字数代码128000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织128KX8
封装主体材料PLASTIC/EPOXY
封装代码TSOP1
封装等效代码TSSOP32,.8,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
编程电压5 V
认证状态Not Qualified
座面最大高度1.2 mm
部门规模8K,4K,8K,32K,64K
最大待机电流0.000005 A
最大压摆率0.05 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
切换位YES
类型NOR TYPE
宽度8 mm
Base Number Matches1

文档预览

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MX29F001T/B
1M-BIT [128K x 8] CMOS FLASH MEMORY
FEATURES
5.0V
±
10% for read, erase and write operation
131072x8 only organization
Fast access time: 90/120ns
Low power consumption
- 30mA maximum active current(5MHz)
- 1u
A
typical standby current
• Command register architecture
- Byte Programming (7us typical)
- Sector Erase (8K-Byte x 1, 4K-Byte x 2, 8K Byte
x 2, 32K-Byte x 1, and 64K-Byte x 1)
• Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors
with Erase Suspend capability.
- Automatically programs and verifies data at
specified address
• Erase Suspend/Erase Resume
– Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation.
• Status Reply
- Data polling & Toggle bit for detection of program
and erase cycle completion.
• Chip protect/unprotect for 5V only system or 5V/12V
system
• 100,000 minimum erase/program cycles
• Latch-up protected to 100mA from -1 to VCC+1V
• Boot Code Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
• Low VCC write inhibit is equal to or less than 3.2V
• Package type:
- 32-pin PLCC
- 32-pin TSOP
- 32-pin PDIP
• Boot Code Sector Architecture
- T=Top Boot Sector
- B=Bottom Boot Sector
• 20 years data retention
GENERAL DESCRIPTION
The MX29F001T/B is a 1-mega bit Flash memory
organized as 128K bytes of 8 bits only MXIC's
Flash memories offer the most cost-effective and
reliable read/write non-volatile random access
memory. The MX29F001T/B is packaged in 32-pin
PLCC, TSOP, PDIP. It is designed to be repro-
grammed and erased in-system or in-standard
EPROM programmers.
The standard MX29F001T/B offers access time
90ns. To eliminate bus contention, the MX29F001T/
B has separate chip enable (CE) and output enable
(OE) controls.
MXIC's Flash memories augment EPROM function-
ality with in-circuit electrical erasure and
programming. The MX29F001T/B uses a command
register to manage this functionality. The command
register allows for 100% TTL level control inputs
and fixed power supply levels during erase and
programming, while maintaining maximum EPROM
compatibility.
MXIC Flash technology reliably stores memory con-
tents even after 100,000 erase and program cycles.
The MXIC cell is designed to optimize the erase and
programming mechanisms. In addition, the combi-
nation of advanced tunnel oxide processing and low
internal electric fields for erase and programming
operations produces reliable cycling.
The
MX29F001T/B uses a 5.0V
±
10% VCC supply to
perform the High Reliability Erase and auto
Program/Erase algorithms.
The highest degree of latch-up protection is
achieved with MXIC's proprietary non-epi process.
Latch-up protection is proved for stresses up to 100
milliamps on address and data pin from -1V to VCC
+ 1V.
P/N: PM0515
REV. 2.6, DEC. 29, 2003
1

MX29F001BTC-12相似产品对比

MX29F001BTC-12 MX29F001BPC-12 MX29F001BQC-12 MX29F001BPC-90 MX29F001BQC-90 MX29F001BTC-90
描述 Flash, 128KX8, 120ns, PDSO32, 8 X 20 MM, PLASTIC, MO-142, TSOP1-32 Flash, 128KX8, 120ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Flash, 128KX8, 120ns, PQCC32, PLASTIC, MS-016, LCC-32 Flash, 128KX8, 90ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Flash, 128KX8, 90ns, PQCC32, PLASTIC, MS-016, LCC-32 Flash, 128KX8, 90ns, PDSO32, 8 X 20 MM, PLASTIC, MO-142, TSOP1-32
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 TSOP1 DIP LCC DIP LCC TSOP1
包装说明 8 X 20 MM, PLASTIC, MO-142, TSOP1-32 0.600 INCH, PLASTIC, DIP-32 PLASTIC, MS-016, LCC-32 DIP, DIP32,.6 QCCJ, LDCC32,.5X.6 TSOP1, TSSOP32,.8,20
针数 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 120 ns 120 ns 120 ns 90 ns 90 ns 90 ns
启动块 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
命令用户界面 YES YES YES YES YES YES
数据轮询 YES YES YES YES YES YES
JESD-30 代码 R-PDSO-G32 R-PDIP-T32 R-PQCC-J32 R-PDIP-T32 R-PQCC-J32 R-PDSO-G32
JESD-609代码 e0 e0 e0 e0 e0 e0
长度 18.4 mm 41.91 mm 14.0462 mm 41.91 mm 14.0462 mm 18.4 mm
内存密度 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
内存集成电路类型 FLASH FLASH FLASH FLASH FLASH FLASH
内存宽度 8 8 8 8 8 8
功能数量 1 1 1 1 1 1
部门数/规模 1,2,2,1,1 1,2,2,1,1 1,2,2,1,1 1,2,2,1,1 1,2,2,1,1 1,2,2,1,1
端子数量 32 32 32 32 32 32
字数 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
字数代码 128000 128000 128000 128000 128000 128000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP1 DIP QCCJ DIP QCCJ TSOP1
封装等效代码 TSSOP32,.8,20 DIP32,.6 LDCC32,.5X.6 DIP32,.6 LDCC32,.5X.6 TSSOP32,.8,20
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 5 V 5 V 5 V 5 V 5 V 5 V
编程电压 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 4.9022 mm 3.55 mm 4.9022 mm 3.55 mm 1.2 mm
部门规模 8K,4K,8K,32K,64K 8K,4K,8K,32K,64K 8K,4K,8K,32K,64K 8K,4K,8K,32K,64K 8K,4K,8K,32K,64K 8K,4K,8K,32K,64K
最大待机电流 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A
最大压摆率 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES NO YES NO YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING THROUGH-HOLE J BEND THROUGH-HOLE J BEND GULL WING
端子节距 0.5 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 0.5 mm
端子位置 DUAL DUAL QUAD DUAL QUAD DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
切换位 YES YES YES YES YES YES
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 8 mm 15.24 mm 11.5062 mm 15.24 mm 11.5062 mm 8 mm
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