HCPL-0738
High Speed CMOS Optocoupler
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
The HCPL-0738 is a dual-channel 15 MBd CMOS
optocoupler in SOIC-8 package. The HCPL-0738
optocoupler utilizes the latest CMOS IC technol-
ogy to achieve out-standing performance with very low
power consumption. Basic building blocks of HCPL-0738
are high speed LEDs and CMOS detector ICs. Avago also
offers the same performance in the single channel ver-
sion, HCPL-0708. Each detector incorporates an integrated
photodiode, a high speed transimpedance amplifier, and
a voltage comparator with an output driver.
Features
• 15 ns typical pulse width distortion
• 40 ns maximum propagation delay skew
• 20 ns typical propagation delay
• High speed: 15 MBd
• + 5 V CMOS compatibility
• 10 kV/µS minimum common mode rejection
• –40 to 100˚C temperature range
• Safety and regulatory approvals
– UL recognized (3750 V rms for 1 minute per UL
1577)
– CSA component acceptance notice #5.
– IEC/EN/DIN EN 60747-5-2 approved for HCPL-0738
Option 060
Applications
• PDP (plasma display panel)
• Digital field bus isolation: DeviceNet, SDS, Profibus
• Multiplexed data transmission
• Computer peripheral interface
• Microprocessor system interface
• DC/DC converter
Functional Diagram
ANODE 1
CATHODE 1
CATHODE 2
ANODE 2
1
2
3
4
8
7
6
5
V
DD
V
O
1
V
O
2
GND
Truth Table
LED
OFF
ON
TRUTH TABLE
V
O
, OUTPUT
LED
OFF
ON
V
O
, Output
H
H
L
L
Note: A 0.1 µF bypass capacitor must be con-
nected between pins 5 and 8.
CAUTION:
It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
Ordering Information
HCPL-0738 is UL Recognized with 3750 Vrms for 1 minute per UL1577.
Option
Part number
RoHS
Compliant
-000E
HCPL-0738
-500E
-060E
-560E
Non RoHS
Compliant
No option
-500
-060
-560
SO-8
Surface Gull Tape UL 5000 Vrms/
Package Mount Wing & Reel 1 Minute rating
X
X
X
X
X
X
X
X
IEC/EN/DIN
EN 60747-5-2 Quantity
100 per tube
1500 per reel
100 per tube
1500 per reel
To order, choose a part number from the part number column and combine with the desired option from the op-
tion column to form an order entry.
Example 1:
HCPL-0738-500E to order product of Small Outline SO-8 package in Tape and Reel packaging in RoHS compliant.
Example 2:
HCPL-0738 to order product of Small Outline SO-8 package in tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Selection Guide
Small Outline SO-8
HCPL-0738
Package Outline Drawing
HCPL-0738 Outline Drawing (Small Outline SO-8 Package)
LAND PATTERN RECOMMENDATION
8
3.937 ± 0.127
(0.155 ± 0.005)
PIN 1
ONE
7
6
XXX
YWW
5
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
7.49 (0.295)
2
3
4
1.270 BSC
(0.050)
DATE CODE
1.9 (0.075)
0.64 (0.025)
7°
45° x 0.432
(0.017)
0.405 ± 0.076
(0.015 ± 0.003)
*5.080 ± 0.127
(0.205 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0 - 7°
0.228 ± 0.025
(0.009 ± 0.001)
0.202 ± 0.102
(0.008 ± 0.004)
0.305
MIN.
(0.012)
*TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
TEMPERATURE (°C)
200
160°C
150°C
140°C
2.5°C ± 0.5°C/SEC.
30
SEC.
3°C + 1°C/–0.5°C
30
SEC.
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
t
p
T
p
TEMPERATURE
T
L
T
smax
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
t
s
PREHEAT
60 to 180 SEC.
217 °C
260 +0/-5 °C
RAMP-DOWN
6 °C/SEC. MAX.
T
smin
t
L
60 to 150 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
Note: Non-halide flux should be used.
3
Regulatory Information
The HCPL-0738 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(Option 060 only)
Value
.9
.8
0.08
≥ 175
IIIa
Units
mm
mm
mm
Volts
Conditions
Measured from input terminals to output terminals,
shortest distance through air.
Measured from input terminals to output terminals,
shortest distance path along body.
Insulation thickness between emitter and detector; also
known as distance through insulation.
DIN IEC 11/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
the surface of a printed circuit board between the solder
fillets of the input and output leads must be considered.
There are recommended techniques such as grooves
and ribs which may be used on a printed circuit board
to achieve desired creepage and clearances. Creepage
and clearance distances will also change depending on
factors such as pollution degree and insulation level.
Insulation and Safety Related Specifications (approval pending)
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Symbol
L(I01)
L(I0)
CTI
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements. However, once mounted on a printed
circuit board, minimum creepage and clearance require-
ments must be met as specified for individual equipment
standards. For creepage, the shortest distance path along
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Supply Voltage
Output Voltage
Average Forward Input Current
Average Output Current
Lead Solder Temperature
Solder Reflow Temperature Profile
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltages
Input Current (ON)
Symbol
T
S
T
A
V
DD
V
O
I
F
I
O
Minimum
–55
–0
0
–0.5
—
—
Maximum
15
100
6.0
V
DD
+ 0.5
0
Units
˚C
˚C
Volts
Volts
mA
mA
60˚C for 10 seconds, 1.6 mm below seating plane
See Solder Reflow Thermal Profile section
Symbol
T
A
V
DD
I
F
Minimum
–0
.5
10
Maximum
100
5.5
16
Units
˚C
V
mA
Electrical Specifications
Over recommended temperature (T
A
= –0˚C to +100˚C) and .5 V ≤ V
DD
≤ 5.5 V.
All typical specifications are at T
A
= 5˚C, V
DD
= +5 V.
Parameter
Symbol
Min.
Typ.
Max.
Input Forward Voltage
V
F
1.3
1.5
1.8
Input Reverse Breakdown
Voltage
Logic High Output Voltage
Logic Low Output Voltage
Input Threshold Current
Logic Low Output Supply
Current
Logic High Output Supply
Current
BV
R
V
OH
V
OL
I
TH
I
DDL
I
DDH
5
.0
5
0.01
.5
10
8
0.1
8.
18.0
15.0
Units
V
V
V
V
mA
mA
mA
Test Conditions
I
F
= 1 mA
I
R
= 10 µA
I
F
= 0, I
O
= –0 µA
I
F
= 1 mA, I
O
= 0 µA
I
OL
= 0 µA
I
F
= 1 mA
I
F
= 0 mA
Fig.
1
Notes
3
Switching Specifications
Over recommended temperature (T
A
= –0˚C to +100˚C) and .5 V ≤ V
DD
≤ 5.5 V.
All typical specifications are at T
A
= 5˚C, V
DD
= +5 V.
Parameter
Propagation Delay Time
to Logic Low Output
Propagation Delay Time
to Logic High Output
Pulse Width
Pulse Width Distortion
Propagation Delay Skew
Output Rise Time
(10% – 90%)
Output Fall Time
(90% – 10%)
Common Mode Transient
Immunity at Logic High Output
Common Mode Transient
Immunity at Logic Low Output
Symbol
t
PHL
t
PLH
PW
|PWD|
t
PSK
t
R
t
F
|CM
H
|
|CM
L
|
Min.
0
11
100
0
10
10
Typ.
35
0
15
0
5
15
15
Max.
60
60
30
0
Units
ns
ns
ns
ns
ns
ns
ns
kV/µS
kV/µS
I
F
= 1 mA, C
L
= 15 pF
CMOS Signal Levels
I
F
= 1 mA, C
L
= 15 pF
CMOS Signal Levels
I
F
= 0 mA, C
L
= 15 pF
CMOS Signal Levels
I
F
= 1 mA, C
L
= 15 pF
CMOS Signal Levels
V
CM
= 1000 V, T
A
= 5˚C,
I
F
= 0 mA
V
CM
= 1000 V, T
A
= 5˚C,
I
F
= 1 mA
5
5
3
Test Conditions
I
F
= 1 mA, C
L
= 15 pF
CMOS Signal Levels
I
F
= 1 mA, C
L
= 15 pF
CMOS Signal Levels
Fig.
5
5
Notes
1
1
5