Synchronous DRAM Module, 8MX64, 5.4ns, CMOS, DIMM-144
| 参数名称 | 属性值 |
| 零件包装代码 | DIMM |
| 包装说明 | , |
| 针数 | 144 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | FOUR BANK PAGE BURST |
| 最长访问时间 | 5.4 ns |
| 其他特性 | AUTO REFRESH, SELF REFRESH |
| JESD-30 代码 | R-XDMA-N144 |
| 内存密度 | 536870912 bit |
| 内存集成电路类型 | SYNCHRONOUS DRAM MODULE |
| 内存宽度 | 64 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 144 |
| 字数 | 8388608 words |
| 字数代码 | 8000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 8MX64 |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified |
| 自我刷新 | YES |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| MT8LSDT864HG-13EB5 | MT8LSDT864HG-133B5 | MT8LSDT864LHG-133B5 | MT8LSDT864LHG-662B5 | MT8LSDT864HG-662B5 | MT8LSDT864LHG-13EB5 | |
|---|---|---|---|---|---|---|
| 描述 | Synchronous DRAM Module, 8MX64, 5.4ns, CMOS, DIMM-144 | Synchronous DRAM Module, 8MX64, 6ns, CMOS, DIMM-144 | Synchronous DRAM Module, 8MX64, 6ns, CMOS, DIMM-144 | Synchronous DRAM Module, 8MX64, 9ns, CMOS, DIMM-144 | Synchronous DRAM Module, 8MX64, 9ns, CMOS, DIMM-144 | Synchronous DRAM Module, 8MX64, 5.4ns, CMOS, DIMM-144 |
| 零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
| 针数 | 144 | 144 | 144 | 144 | 144 | 144 |
| Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| 最长访问时间 | 5.4 ns | 6 ns | 6 ns | 9 ns | 9 ns | 5.4 ns |
| 其他特性 | AUTO REFRESH, SELF REFRESH | AUTO REFRESH, SELF REFRESH | AUTO REFRESH, SELF REFRESH | AUTO REFRESH, SELF REFRESH | AUTO REFRESH, SELF REFRESH | AUTO REFRESH, SELF REFRESH |
| JESD-30 代码 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 |
| 内存密度 | 536870912 bit | 536870912 bi | 536870912 bi | 536870912 bit | 536870912 bit | 536870912 bi |
| 内存集成电路类型 | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
| 内存宽度 | 64 | 64 | 64 | 64 | 64 | 64 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 144 | 144 | 144 | 144 | 144 | 144 |
| 字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
| 字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 8MX64 | 8MX64 | 8MX64 | 8MX64 | 8MX64 | 8MX64 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 自我刷新 | YES | YES | YES | YES | YES | YES |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | - | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
模拟与混合信号
微控制器 MCU
嵌入式系统
微控制器 MCU
模拟与混合信号
FPGA/CPLD
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
