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MPC603PRX233LX

产品描述RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小157KB,共40页
制造商Motorola ( NXP )
官网地址https://www.nxp.com
下载文档 详细参数 选型对比 全文预览

MPC603PRX233LX概述

RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

MPC603PRX233LX规格参数

参数名称属性值
包装说明BGA,
Reach Compliance Codeunknown
ECCN代码3A001.A.3
地址总线宽度32
位大小32
边界扫描YES
最大时钟频率233 MHz
外部数据总线宽度64
格式FLOATING POINT
集成缓存YES
JESD-30 代码S-CBGA-B255
长度21 mm
低功率模式YES
端子数量255
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
认证状态Not Qualified
座面最大高度3 mm
速度233 MHz
最大供电电压2.625 V
最小供电电压2.375 V
标称供电电压2.5 V
表面贴装YES
技术CMOS
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
宽度21 mm
uPs/uCs/外围集成电路类型MICROPROCESSOR, RISC
Base Number Matches1

MPC603PRX233LX相似产品对比

MPC603PRX233LX MPC603PFE166LX MPC603PFE220LX MPC603PRX220LX MPC603PRX225LX MPC603PFE225LX MPC603PFE240LX
描述 RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 RISC Microprocessor, 32-Bit, 166MHz, CMOS, CQFP240, 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 RISC Microprocessor, 32-Bit, 220MHz, CMOS, CQFP240, 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 RISC Microprocessor, 32-Bit, 220MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 RISC Microprocessor, 32-Bit, 225MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 RISC Microprocessor, 32-Bit, 225MHz, CMOS, CQFP240, 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 RISC Microprocessor, 32-Bit, 240MHz, CMOS, CQFP240, 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
包装说明 BGA, FQFP, FQFP, BGA, BGA, FQFP, FQFP,
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknow
ECCN代码 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
地址总线宽度 32 32 32 32 32 32 32
位大小 32 32 32 32 32 32 32
边界扫描 YES YES YES YES YES YES YES
最大时钟频率 233 MHz 166 MHz 220 MHz 220 MHz 225 MHz 225 MHz 240 MHz
外部数据总线宽度 64 64 64 64 64 64 64
格式 FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
集成缓存 YES YES YES YES YES YES YES
JESD-30 代码 S-CBGA-B255 S-CQFP-G240 S-CQFP-G240 S-CBGA-B255 S-CBGA-B255 S-CQFP-G240 S-CQFP-G240
长度 21 mm 32 mm 32 mm 21 mm 21 mm 32 mm 32 mm
低功率模式 YES YES YES YES YES YES YES
端子数量 255 240 240 255 255 240 240
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 BGA FQFP FQFP BGA BGA FQFP FQFP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY FLATPACK, FINE PITCH FLATPACK, FINE PITCH GRID ARRAY GRID ARRAY FLATPACK, FINE PITCH FLATPACK, FINE PITCH
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3 mm 4.15 mm 4.15 mm 3 mm 3 mm 4.15 mm 4.15 mm
速度 233 MHz 166 MHz 220 MHz 220 MHz 225 MHz 225 MHz 240 MHz
最大供电电压 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V
最小供电电压 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V
标称供电电压 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
端子形式 BALL GULL WING GULL WING BALL BALL GULL WING GULL WING
端子节距 1.27 mm 0.5 mm 0.5 mm 1.27 mm 1.27 mm 0.5 mm 0.5 mm
端子位置 BOTTOM QUAD QUAD BOTTOM BOTTOM QUAD QUAD
宽度 21 mm 32 mm 32 mm 21 mm 21 mm 32 mm 32 mm
uPs/uCs/外围集成电路类型 MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
厂商名称 - Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )

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