Video Amplifier, Bipolar, PDIP14,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linfinity Microelectronics |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| 商用集成电路类型 | VIDEO AMPLIFIER |
| JESD-30 代码 | R-PDIP-T14 |
| JESD-609代码 | e0 |
| 端子数量 | 14 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | +-6 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| SG733CN | SG733CJ | SG733J | SG733J/883B | SG733J/883C | SG733T | SG733T/883B | |
|---|---|---|---|---|---|---|---|
| 描述 | Video Amplifier, Bipolar, PDIP14, | Video Amplifier, Bipolar, CDIP14, | Video Amplifier, Bipolar, CDIP14, | Video Amplifier, Bipolar, CDIP14, | Video Amplifier, Bipolar, CDIP14, | Video Amplifier, Bipolar, MBCY10, | Video Amplifier, Bipolar, MBCY10, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| 商用集成电路类型 | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER |
| JESD-30 代码 | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | O-MBCY-W10 | O-MBCY-W10 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 10 | 10 |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | METAL | METAL |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | CAN10,.23 | CAN10,.23 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND | ROUND |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CYLINDRICAL | CYLINDRICAL |
| 电源 | +-6 V | +-6 V | +-6 V | +-6 V | +-6 V | +-6 V | +-6 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | WIRE | WIRE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM | BOTTOM |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | - | - |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | - | - |
| 表面贴装 | NO | NO | NO | NO | NO | - | - |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
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