Waveform Generation, BIPolar, PDSO8
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | SOP, SOP8,.25 |
Reach Compliance Code | unknown |
模拟集成电路 - 其他类型 | WAVEFORM GENERATION |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e0 |
标称负供电电压 (Vsup) | -6 V |
端子数量 | 8 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | +-6 V |
标称供电电压 (Vsup) | 6 V |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
NE566DSIIB | SE566F/883B | SE566F/883C | NE566DSIIA | SE566NSIIB | SE566NSIIA | NE566T | |
---|---|---|---|---|---|---|---|
描述 | Waveform Generation, BIPolar, PDSO8 | Waveform Generation, BIPolar, CDIP14 | Waveform Generation, BIPolar, CDIP14 | Waveform Generation, BIPolar, PDSO8 | Waveform Generation, BIPolar, PDIP8 | Waveform Generation, BIPolar, PDIP8 | Waveform Generation, BIPolar, MBCY8 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | SOP, SOP8,.25 | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, SOP8,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 | , CAN8,.2 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
模拟集成电路 - 其他类型 | WAVEFORM GENERATION | WAVEFORM GENERATION | WAVEFORM GENERATION | WAVEFORM GENERATION | WAVEFORM GENERATION | WAVEFORM GENERATION | WAVEFORM GENERATION |
JESD-30 代码 | R-PDSO-G8 | R-XDIP-T14 | R-XDIP-T14 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | O-MBCY-W8 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
标称负供电电压 (Vsup) | -6 V | -6 V | -6 V | -6 V | -6 V | -6 V | -6 V |
端子数量 | 8 | 14 | 14 | 8 | 8 | 8 | 8 |
最高工作温度 | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C |
最低工作温度 | - | -55 °C | -55 °C | - | -55 °C | -55 °C | - |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | METAL |
封装等效代码 | SOP8,.25 | DIP14,.3 | DIP14,.3 | SOP8,.25 | DIP8,.3 | DIP8,.3 | CAN8,.2 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND |
封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | CYLINDRICAL |
电源 | +-6 V | +-6 V | +-6 V | +-6 V | +-6 V | +-6 V | +-6 V |
标称供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | WIRE |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM |
封装代码 | SOP | DIP | DIP | SOP | DIP | DIP | - |
表面贴装 | YES | NO | NO | YES | NO | NO | - |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | - |
Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
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