Microcontroller, 4-Bit, MROM, 4.19MHz, CMOS, PQFP44, PLASTIC, QFP-44
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | PLASTIC, QFP-44 |
Reach Compliance Code | compliant |
具有ADC | NO |
地址总线宽度 | |
位大小 | 4 |
最大时钟频率 | 5 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | S-PQFP-G44 |
JESD-609代码 | e0 |
长度 | 10 mm |
I/O 线路数量 | 34 |
端子数量 | 44 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装形状 | SQUARE |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
ROM可编程性 | MROM |
座面最大高度 | 3 mm |
速度 | 4.19 MHz |
最大压摆率 | 8 mA |
最大供电电压 | 6 V |
最小供电电压 | 2.7 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
Base Number Matches | 1 |
UPD75008GB-XXX-3B4 | UPD75P008GB-3B4 | UPD75006CU-XXX | UPD75004CU-XXX | UPD75004GB-XXX-3B4 | UPD75P008CU | |
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描述 | Microcontroller, 4-Bit, MROM, 4.19MHz, CMOS, PQFP44, PLASTIC, QFP-44 | Microcontroller, 4-Bit, OTPROM, 4.19MHz, CMOS, PQFP44, PLASTIC, QFP-44 | Microcontroller, 4-Bit, MROM, 4.19MHz, CMOS, PDIP42, PLASTIC, SDIP-42 | Microcontroller, 4-Bit, MROM, 4.19MHz, CMOS, PDIP42, PLASTIC, SDIP-42 | Microcontroller, 4-Bit, MROM, 4.19MHz, CMOS, PQFP44, PLASTIC, QFP-44 | Microcontroller, 4-Bit, OTPROM, 4.19MHz, CMOS, PDIP42, PLASTIC, SDIP-42 |
包装说明 | PLASTIC, QFP-44 | PLASTIC, QFP-44 | PLASTIC, SDIP-42 | PLASTIC, SDIP-42 | PLASTIC, QFP-44 | PLASTIC, SDIP-42 |
Reach Compliance Code | compliant | unknown | compliant | compliant | compliant | unknown |
具有ADC | NO | NO | NO | NO | NO | NO |
位大小 | 4 | 4 | 4 | 4 | 4 | 4 |
最大时钟频率 | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | S-PQFP-G44 | S-PQFP-G44 | R-PDIP-T42 | R-PDIP-T42 | S-PQFP-G44 | R-PDIP-T42 |
I/O 线路数量 | 34 | 34 | 34 | 34 | 34 | 34 |
端子数量 | 44 | 44 | 42 | 42 | 44 | 42 |
最高工作温度 | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
最低工作温度 | -40 °C | -10 °C | -40 °C | -40 °C | -40 °C | -10 °C |
PWM 通道 | NO | NO | NO | NO | NO | NO |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QFP | SDIP | SDIP | QFP | SDIP |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | FLATPACK | IN-LINE, SHRINK PITCH |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM可编程性 | MROM | OTPROM | MROM | MROM | MROM | OTPROM |
座面最大高度 | 3 mm | 3 mm | 5.08 mm | 5.08 mm | 3 mm | 5.08 mm |
速度 | 4.19 MHz | 4.19 MHz | 4.19 MHz | 4.19 MHz | 4.19 MHz | 4.19 MHz |
最大压摆率 | 8 mA | 15 mA | 8 mA | 8 mA | 8 mA | 15 mA |
最大供电电压 | 6 V | 5.5 V | 6 V | 6 V | 6 V | 5.5 V |
最小供电电压 | 2.7 V | 4.5 V | 2.7 V | 2.7 V | 2.7 V | 4.5 V |
表面贴装 | YES | YES | NO | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 0.8 mm | 0.8 mm | 1.778 mm | 1.778 mm | 0.8 mm | 1.778 mm |
端子位置 | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL |
宽度 | 10 mm | 10 mm | 15.24 mm | 15.24 mm | 10 mm | 15.24 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
JESD-609代码 | e0 | - | e0 | e0 | e0 | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
端子面层 | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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