Digital Potentiometer, 4 Func, 100000ohm, 3-wire Serial Control Interface, 256 Positions, CMOS, BUMP, CSP-24
参数名称 | 属性值 |
包装说明 | BUMP, CSP-24 |
Reach Compliance Code | unknown |
其他特性 | NONVOLATILE MEMORY |
控制接口 | 3-WIRE SERIAL |
转换器类型 | DIGITAL POTENTIOMETER |
JESD-30 代码 | R-XBGA-B24 |
长度 | 4.579 mm |
功能数量 | 4 |
位置数 | 256 |
端子数量 | 24 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | UNSPECIFIED |
封装代码 | VFBGA |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
认证状态 | Not Qualified |
电阻定律 | LINEAR |
最大电阻容差 | 20% |
最大电阻器端电压 | 5.5 V |
最小电阻器端电压 | -5.5 V |
座面最大高度 | 0.71 mm |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
标称温度系数 | 300 ppm/°C |
温度等级 | COMMERCIAL |
端子形式 | BALL |
端子节距 | 0.5 mm |
端子位置 | BOTTOM |
标称总电阻 | 100000 Ω |
宽度 | 2.801 mm |
Base Number Matches | 1 |
X9250TB24T1 | X9250UB24I-2.7T1 | X9250UB24IT1 | X9250TB24I-2.7T1 | X9250UB24-2.7T1 | |
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描述 | Digital Potentiometer, 4 Func, 100000ohm, 3-wire Serial Control Interface, 256 Positions, CMOS, BUMP, CSP-24 | Digital Potentiometer, 4 Func, 50000ohm, 3-wire Serial Control Interface, 256 Positions, CMOS, BUMP, CSP-24 | Digital Potentiometer, 4 Func, 50000ohm, 3-wire Serial Control Interface, 256 Positions, CMOS, BUMP, CSP-24 | Digital Potentiometer, 4 Func, 100000ohm, 3-wire Serial Control Interface, 256 Positions, CMOS, BUMP, CSP-24 | Digital Potentiometer, 4 Func, 50000ohm, 3-wire Serial Control Interface, 256 Positions, CMOS, BUMP, CSP-24 |
包装说明 | BUMP, CSP-24 | BUMP, CSP-24 | BUMP, CSP-24 | BUMP, CSP-24 | BUMP, CSP-24 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
其他特性 | NONVOLATILE MEMORY | NONVOLATILE MEMORY | NONVOLATILE MEMORY | NONVOLATILE MEMORY | NONVOLATILE MEMORY |
控制接口 | 3-WIRE SERIAL | 3-WIRE SERIAL | 3-WIRE SERIAL | 3-WIRE SERIAL | 3-WIRE SERIAL |
转换器类型 | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER | DIGITAL POTENTIOMETER |
JESD-30 代码 | R-XBGA-B24 | R-XBGA-B24 | R-XBGA-B24 | R-XBGA-B24 | R-XBGA-B24 |
长度 | 4.579 mm | 4.579 mm | 4.579 mm | 4.579 mm | 4.579 mm |
功能数量 | 4 | 4 | 4 | 4 | 4 |
位置数 | 256 | 256 | 256 | 256 | 256 |
端子数量 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | - |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
电阻定律 | LINEAR | LINEAR | LINEAR | LINEAR | LINEAR |
最大电阻容差 | 20% | 20% | 20% | 20% | 20% |
最大电阻器端电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小电阻器端电压 | -5.5 V | -5.5 V | -5.5 V | -5.5 V | -5.5 V |
座面最大高度 | 0.71 mm | 0.71 mm | 0.71 mm | 0.71 mm | 0.71 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
标称温度系数 | 300 ppm/°C | 300 ppm/°C | 300 ppm/°C | 300 ppm/°C | 300 ppm/°C |
温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
标称总电阻 | 100000 Ω | 50000 Ω | 50000 Ω | 100000 Ω | 50000 Ω |
宽度 | 2.801 mm | 2.801 mm | 2.801 mm | 2.801 mm | 2.801 mm |
Base Number Matches | 1 | 1 | 1 | - | - |
厂商名称 | - | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc |
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