200mA, 200V, 2 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, MO-041BB, HERMETIC SEALED, CERAMIC, LCC2-6
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | LCC |
| 包装说明 | SMALL OUTLINE, R-CDSO-N6 |
| 针数 | 6 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最大集电极电流 (IC) | 0.2 A |
| 集电极-发射极最大电压 | 200 V |
| 配置 | SEPARATE, 2 ELEMENTS |
| 最小直流电流增益 (hFE) | 25 |
| JEDEC-95代码 | MO-041BB |
| JESD-30 代码 | R-CDSO-N6 |
| JESD-609代码 | e4 |
| 元件数量 | 2 |
| 端子数量 | 6 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 极性/信道类型 | NPN |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 端子面层 | GOLD |
| 端子形式 | NO LEAD |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 晶体管元件材料 | SILICON |
| 标称过渡频率 (fT) | 110 MHz |
| Base Number Matches | 1 |

| BFT58DCSM-JQR-BG4 | BFT58DCSM-JQRG4 | BFT58DCSMG4 | BFT58DCSM-JQR-AG4 | BFT58DCSM-JQR | |
|---|---|---|---|---|---|
| 描述 | 200mA, 200V, 2 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, MO-041BB, HERMETIC SEALED, CERAMIC, LCC2-6 | 200mA, 200V, 2 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, MO-041BB, HERMETIC SEALED, CERAMIC, LCC2-6 | 200mA, 200V, 2 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, MO-041BB, HERMETIC SEALED, CERAMIC, LCC2-6 | 200mA, 200V, 2 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, MO-041BB, HERMETIC SEALED, CERAMIC, LCC2-6 | 200mA, 200V, 2 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, MO-041BB, HERMETIC SEALED, CERAMIC, LCC2-6 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 不符合 |
| 零件包装代码 | LCC | LCC | LCC | LCC | LCC |
| 包装说明 | SMALL OUTLINE, R-CDSO-N6 | SMALL OUTLINE, R-CDSO-N6 | SMALL OUTLINE, R-CDSO-N6 | SMALL OUTLINE, R-CDSO-N6 | SMALL OUTLINE, R-CDSO-N6 |
| 针数 | 6 | 6 | 6 | 6 | 6 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大集电极电流 (IC) | 0.2 A | 0.2 A | 0.2 A | 0.2 A | 0.2 A |
| 集电极-发射极最大电压 | 200 V | 200 V | 200 V | 200 V | 200 V |
| 配置 | SEPARATE, 2 ELEMENTS | SEPARATE, 2 ELEMENTS | SEPARATE, 2 ELEMENTS | SEPARATE, 2 ELEMENTS | SEPARATE, 2 ELEMENTS |
| 最小直流电流增益 (hFE) | 25 | 25 | 25 | 25 | 25 |
| JEDEC-95代码 | MO-041BB | MO-041BB | MO-041BB | MO-041BB | MO-041BB |
| JESD-30 代码 | R-CDSO-N6 | R-CDSO-N6 | R-CDSO-N6 | R-CDSO-N6 | R-CDSO-N6 |
| 元件数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 6 | 6 | 6 | 6 | 6 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 极性/信道类型 | NPN | NPN | NPN | NPN | NPN |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | YES | YES |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON |
| 标称过渡频率 (fT) | 110 MHz | 110 MHz | 110 MHz | 110 MHz | 110 MHz |
| JESD-609代码 | e4 | e4 | e4 | e4 | - |
| 端子面层 | GOLD | GOLD | GOLD | GOLD | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
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