The documentation and process conversion
measures necessary to comply with this
revision shall be completed by 15 December 1997
INCH POUND
MIL-PRF-19500/437D
15 September 1997
SUPERSEDING
MIL-S-19500/437C
20 December 1994
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON, LOW-NOISE VOLTAGE REGULATOR TYPES,
1N5518B-1, 1N5518C-1, 1N5518D-1 THROUGH 1N5546B-1, 1N5546C-1, 1N5546D-1,
1N5518BUR-1, 1N5518CUR-1, 1N5518DUR-1 THROUGH 1N5546BUR-1, 1N5546CUR-1, 1N5546DUR-1
JAN, JANTX, JANTXV, JANHC, AND JANKC
This specification is approved for use by all Depart-
ments and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for 500 milliwatt, silicon, low-noise, voltage regulator diodes with
voltage tolerances of 5 percent, 2 percent, and 1 percent. Three levels of product assurance is provided for each encapsulated device
type as specified in MIL-PRF-19500, and two levels of product assurance for each unencapsulated device type die. For JANHC and
JANKC quality levels (see 6.5).
1.2 Physical dimensions. See figures 1 (DO-7 and DO-35), 2 (DO-213AA), and 3 (JANHC and JANKC).
1.3 Maximum ratings. Maximum ratings are shown in columns 3, 4, and 10 of table IV herein and as follows:
a.
PT = 500 mW (DO-7 and D0-35) at TL = +50°C, L = .375 inch (9.53 mm); both ends of case or diode body to
heat sink at L = .375 inch (9.53 mm). (Derate IZ to 0.0 mA dc at +175°C).
PT = 500 mW (D0-213AA) at TEC = +125°C. (Derate to 0 at +175°C).
-65°C
≤
Top
≤
+175°C; -65°C
≤
TSTG
≤
+175°C.
b.
c.
1.4 Primary electrical characteristics. Primary electrical characteristic columns 1, 6, 8, and 9 of table IV herein and as follows:
a.
b.
c.
3.3 V dc
≤
Vz
≤
33 V dc.
R
θJL
= 250°C/W (maximum) at L = .375 inch (9.53 mm) (D0-7 and D0-35).
R
θJEC
= 100°C/W (maximum) junction to endcaps (D0-213AA).
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document
should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street, Columbus, OH
43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or
by letter.
AMSC N/A
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
FSC 5961
MIL-PRF-19500/437D
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include
documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has
been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements
documents cited in sections 3 and 4 of this specification, whether or not they are listed.
2.2 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-19500 - Semiconductor Devices, General Specification for.
STANDARD
MILITARY
MIL-STD-750 - Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for
related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing
on the applicable qualified products list before contract award (see 4.2 and 6.3).
3.2 Associated specification. The individual item performance requirements shall be in accordance with MIL-PRF-19500, and as
specified herein.
3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions shall be as specified in MIL-PRF-19500 and as
follows:
UR ..........................................................
C-............................................................
D-............................................................
JANH......................................................
JANK ......................................................
Unleaded or surface mounted diodes with round endcaps.
2 percent voltage tolerance devices.
1 percent voltage tolerance devices.
High reliability product assurance level for unencapsulated devices.
Space reliability product assurance level for unencapsulated devices.
3.3 Interface requirements, and physical dimensions. The interface requiements and physical dimensions shall be as specified in
MIL-PRF-19500, and figures 1, 2, and 3 herein.
3.3.1 Lead finish. Unless otherwise specified, lead finish shall be solderable as defined in MIL-PRF-19500, MIL-STD-750, and
herein.
2
MIL-PRF-19500/437D
Dimensions
Ltr
Min
BD
BL
LD
LL
LU
.055
.120
.018
1.000
---
Inches
Max
.107
.300
.022
1.500
.050
Millimeters
Min
1.40
3.05
0.46
25.40
- --
Max
2.72
7.62
0.56
38.10
1.27
4
3
3
Notes
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. Package contour optional within BD and length BL. Heat slugs, if any, shall be included within this cylinder but
shall not be subject to minimum limit of BD.
4. Within this zone lead, diameter may vary to allow for lead finishes and irregularities other than heat slugs.
5. For DO-7 packages (see 3.4.1).
FIGURE 1. Physical dimensions types 1N5518B-1, C-1, and D-1
through 1N5546B-1, C-1, D-1 (DO-7 and DO-35).
3
MIL-PRF-19500/437D
Dimensions
Ltr
Min
BD
BL
ECT
S
.063
.130
.016
.001 min
Inches
Max
.067
.146
.022
Millimeter
Min
1.60
3.30
0.41
0.03 min
Max
1.70
3.71
0.56
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
FIGURE 2. Physical dimensions 1N5518BUR-1, CUR-1, and DUR-1
through 1N5546BUR-1, CUR-1, DUR-1 (DO-213AA).
4
MIL-PRF-19500/437D
JANHCA and JANKCA die
dimensions
Ltr
Min
A
B
.021
.013
Inche
Max
.025
.017
Millimeters
Min
0.53
0.33
Max
0.64
0.43
A
B
Ltr
JANHCB and JANKCB die
dimensions
Inches
Min
.024
.017
Max
.028
.021
Millimeters
Min
0.61
0.43
Max
0.71
0.53
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. The JANHCA and JANKCA die thickness is .010 inch (0.25 mm) ±.002 inches (0.05 mm). Anode metallization: Al,
thickness = 25,000 Å minimum; cathode metallization: Thickness = 4,000 Å minimum.
4. The JANHCB and JANKCB die thickness is .010 inch (0.25 mm) ±.002 inch (0.05 mm). Anode metallization: Al,
thickness = 40,000 Å minimum; cathode metallization: Au, thickness = 5,000 Å minimum.
5. Circuit layout data: For zener operation, cathode must be operated positive with respect to anode.
6. Requirements in accordance with appendix G, MIL-PRF-19500, are performed in a TO-5 package
(see 6.5).
FIGURE 3. Physical dimensions JANHC and JANKC die.
5
FPGA/CPLD
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