Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32
参数名称 | 属性值 |
包装说明 | 0.525 INCH, PLASTIC, SOP-32 |
Reach Compliance Code | unknown |
最长访问时间 | 100 ns |
JESD-30 代码 | R-PDSO-G32 |
内存密度 | 1048576 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 32 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 128KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 2.95 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 11.3 mm |
Base Number Matches | 1 |
UPD431000AGW-10L-E2 | UPD431000AGW-10L | UPD431000AGW-10LL | UPD431000AGW-10LL-E2 | |
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描述 | Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 | Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 | Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 | Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 |
包装说明 | 0.525 INCH, PLASTIC, SOP-32 | 0.525 INCH, PLASTIC, SOP-32 | 0.525 INCH, PLASTIC, SOP-32 | 0.525 INCH, PLASTIC, SOP-32 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
最长访问时间 | 100 ns | 100 ns | 100 ns | 100 ns |
JESD-30 代码 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.95 mm | 2.95 mm | 2.95 mm | 2.95 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
宽度 | 11.3 mm | 11.3 mm | 11.3 mm | 11.3 mm |
Base Number Matches | 1 | 1 | 1 | 1 |
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