Octal buffer/line driver; inverting 3-State
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | SSOP, SSOP20,.3 |
Reach Compliance Code | unknow |
控制类型 | ENABLE LOW |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e0 |
逻辑集成电路类型 | BUS DRIVER |
最大I(ol) | 0.016 A |
位数 | 4 |
功能数量 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | INVERTED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装等效代码 | SSOP20,.3 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
电源 | 3.3 V |
Prop。Delay @ Nom-Su | 18 ns |
认证状态 | Not Qualified |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | DUAL |
74LV240DB | 74LV240 | 74LV240D | 74LV240N | 74LV240PW | 74LV240PWDH | |
---|---|---|---|---|---|---|
描述 | Octal buffer/line driver; inverting 3-State | Octal buffer/line driver; inverting 3-State | Octal buffer/line driver; inverting 3-State | Octal buffer/line driver; inverting 3-State | Octal buffer/line driver; inverting 3-State | Octal buffer/line driver; inverting 3-State |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - |
包装说明 | SSOP, SSOP20,.3 | - | SOP, SOP20,.4 | DIP, DIP20,.3 | TSSOP, TSSOP20,.25 | - |
Reach Compliance Code | unknow | - | unknow | unknow | unknow | - |
控制类型 | ENABLE LOW | - | ENABLE LOW | ENABLE LOW | ENABLE LOW | - |
JESD-30 代码 | R-PDSO-G20 | - | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | - |
JESD-609代码 | e0 | - | e0 | e0 | e0 | - |
逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | - |
最大I(ol) | 0.016 A | - | 0.016 A | 0.016 A | 0.016 A | - |
位数 | 4 | - | 4 | 4 | 4 | - |
功能数量 | 2 | - | 2 | 2 | 2 | - |
端子数量 | 20 | - | 20 | 20 | 20 | - |
最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | - |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | - |
输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | - |
输出极性 | INVERTED | - | INVERTED | INVERTED | INVERTED | - |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | SSOP | - | SOP | DIP | TSSOP | - |
封装等效代码 | SSOP20,.3 | - | SOP20,.4 | DIP20,.3 | TSSOP20,.25 | - |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
电源 | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | - |
Prop。Delay @ Nom-Su | 18 ns | - | 18 ns | 18 ns | 18 ns | - |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | - |
表面贴装 | YES | - | YES | NO | YES | - |
技术 | CMOS | - | CMOS | CMOS | CMOS | - |
温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
端子形式 | GULL WING | - | GULL WING | THROUGH-HOLE | GULL WING | - |
端子节距 | 0.635 mm | - | 1.27 mm | 2.54 mm | 0.635 mm | - |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | - |
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