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BZG04-110

产品描述Surface Mount TVS Diode; Direction: Unidirectional; V(BR) Typ (V): 124V; PPK Max (W): 300W; Condition: 10×1000us; VRWM Max (V): 121V; VBR Min (V): 124.607538V; VBR Max (V): 184.0565925V; IR Max (uA): 0.5uA; VC Max (V): 185V; Package: SMA
产品类别分立半导体    二极管   
文件大小482KB,共4页
制造商Galaxy Microelectronics
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BZG04-110概述

Surface Mount TVS Diode; Direction: Unidirectional; V(BR) Typ (V): 124V; PPK Max (W): 300W; Condition: 10×1000us; VRWM Max (V): 121V; VBR Min (V): 124.607538V; VBR Max (V): 184.0565925V; IR Max (uA): 0.5uA; VC Max (V): 185V; Package: SMA

BZG04-110规格参数

参数名称属性值
零件包装代码SMA
Reach Compliance Codeunknown
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
Base Number Matches1

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Production specification
Transient Voltage Suppressor
Features
BZG04--SERIES
Plastic package has underwriters laboratory
flammability classification 94V-0
Optimized for LAN protection applications
Low profile package with built-in strain relief for
surface mounted applications
Glass passivated junction
Low incremental surge resistance, excellent clamping capability
300W peak pulse power capability with a 10/1000μs wave form,
repetition rate (duty cycle): 0.01%
Very fast response time
High temperature soldering guaranteed: 250°C/10 seconds at terminals
Case: SMA molded plastic
Molding compound, UL flammability classification rating 94V-0
Polarity: Color band denotes cathode end
For bi-directional devices, use suffix C (e.g. BZG04-10C). Electrical characteristics apply in both
directions.
Mechanical Data
Devices for Bidirectional Applications
Maximum Ratings
(@T
A
= 25°C unless otherwise specified)
Parameter
Non-repetitive peak reverse power dissipation 10/1000s
exponential pulse(see Fig.3); T
J
=25℃prior tosurge; see also
Fig.1
Typical thermal resistance, junction to ambient
Forward voltage @I
F
=0.5A; seeFig.2
Operating junction temperature range
Operating storage temperature range
R
θJA
V
F
R
θJL
T
J
100(NOTE1)
150(NOTE2)
1.2
-55---+175
-55---+175
℃/W
V
P
RSM
300
W
Symbol
Value
Units
NOTES:
1. Device mounted on an Al2O3 printed-circuit board, 0.7mm thick; thickness of Cu-layer
≥35m,
see Fig.4.
2.Device mounted on an epoxy-glass printed-circuit board, 1.5mm thick; thickness of Cu-layer
≥40μm
SMA001AA
Rev.B
www.gmicroelec.com

 
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