EE PLD, 13ns, 32-Cell, CMOS, PQCC44,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | QCCJ, LDCC44,.7SQ |
| Reach Compliance Code | unknown |
| 其他特性 | YES |
| 系统内可编程 | YES |
| JESD-30 代码 | S-PQCC-J44 |
| JESD-609代码 | e0 |
| JTAG BST | YES |
| 宏单元数 | 32 |
| 端子数量 | 44 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC44,.7SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 3.3 V |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 13 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| PZ3032CS10A44 | PZ3032NS12BC | PZ3032NS10A44 | PZ3032NS10BC | PZ3032NS12A44 | |
|---|---|---|---|---|---|
| 描述 | EE PLD, 13ns, 32-Cell, CMOS, PQCC44, | EE PLD, 15ns, 32-Cell, CMOS, PQFP44, | EE PLD, 12.5ns, 32-Cell, CMOS, PQCC44, | EE PLD, 12.5ns, 32-Cell, CMOS, PQFP44, | EE PLD, 15ns, 32-Cell, CMOS, PQCC44, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QCCJ, LDCC44,.7SQ | QFP, TQFP44,.47SQ,32 | QCCJ, LDCC44,.7SQ | QFP, TQFP44,.47SQ,32 | QCCJ, LDCC44,.7SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | YES | YES | YES | YES | YES |
| 系统内可编程 | YES | YES | YES | YES | YES |
| JESD-30 代码 | S-PQCC-J44 | S-PQFP-G44 | S-PQCC-J44 | S-PQFP-G44 | S-PQCC-J44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| JTAG BST | YES | YES | YES | YES | YES |
| 宏单元数 | 32 | 32 | 32 | 32 | 32 |
| 端子数量 | 44 | 44 | 44 | 44 | 44 |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QFP | QCCJ | QFP | QCCJ |
| 封装等效代码 | LDCC44,.7SQ | TQFP44,.47SQ,32 | LDCC44,.7SQ | TQFP44,.47SQ,32 | LDCC44,.7SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | FLATPACK | CHIP CARRIER | FLATPACK | CHIP CARRIER |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 13 ns | 15 ns | 12.5 ns | 12.5 ns | 15 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | GULL WING | J BEND | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 0.8 mm | 1.27 mm | 0.8 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 厂商名称 | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
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