OKI Semiconductor
MR27V802F
512k–Word
×
16–Bit or 1M–Word
×
8–Bit
FEDR27V802F-02-03
Issue Date: Jul. 9, 2004
P2ROM
PIN CONFIGURATION (TOP VIEW)
FEATURES
·512k-word
×
16-bit / 1M-word
×
8-bit electrically switchable
configuration
· +3.0 V to 3.6 V power supply
· Access time
70 ns MAX
· Operating current
18 mA MAX(5MHz)
· Standby current
5 µA MAX
· Input/Output TTL compatible
· Three-state output
PACKAGES
· MR27V802F-xxxTN
48-pin plastic TSOP (TSOP I 48-P-1220-0.50-1K)
· MR27V802F-xxxMA
44-pin plastic SOP (SOP44-P-600-1.27-K)
· MR27V802F-xxxTP
44-pin plastic TSOP (TSOP II 44-P-400-0.80-K)
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
V
SS
OE#
D0
D8
D1
D9
D2
D10
D3
D11
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
NC
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#
V
SS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
V
CC
44SOP,
44TSOP(Type-II)
P2ROM ADVANCED TECHNOLOGY
P2ROM stands for Production Programmed ROM. This
exclusive Oki technology utilizes factory test equipment for
programming the customers code into the P2ROM prior to final
production testing. Advancements in this technology allows
production costs to be equivalent to MASKROM and has many
advantages and added benefits over the other non-volatile
technologies, which include the following;
·
Short lead time,
since the P2ROM is programmed at the
final stage of the production process, a large P2ROM
inventory "bank system" of un-programmed packaged
products are maintained to provide an aggressive lead-time
and minimize liability as a custom product.
·
No mask charge,
since P2ROMs do not utilize a custom
mask for storing customer code, no mask charges apply.
·
No additional programming charge,
unlike Flash and
OTP that require additional programming and handling
costs, the P2ROM already has the code loaded at the
factory with minimal effect on the production throughput.
The cost is included in the unit price.
·
Custom Marking is
available at no additional charge.
·
Pin Compatible with Mask ROM
and some FLASH
products.
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
NC
NC
NC
NC
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#
V
SS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
V
CC
D11
D3
D10
D2
D9
D1
D8
D0
OE#
V
SS
CE#
A0
48TSOP(Type-I)
1/10
FEDR27V802F-02-03
OKI Semiconductor
MR27V802F / P2ROM
BLOCK DIAGRAM
A–1
× 8/× 16 Switch
CE#
CE
OE#
OE
BYTE#
Column Decoder
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
Row Decoder
Memory Cell Matrix
512k × 16-Bit or 1M × 8-Bit
Address Buffer
Multiplexer
Output Buffer
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D12
D14
D15
D11
D13
In 8-bit output mode, these pins
are placed in a high-Z state and
pin D15 functions as the A-1
address pin.
PIN DESCRIPTIONS
Pin name
D15 / A–1
A0 to A18
D0 to D14
CE#
OE#
BYTE#
V
CC
V
SS
NC
Address inputs
Data outputs
Chip enable input
Output enable input
Word / Byte select input
Power supply voltage
Ground
No connect
Functions
Data output / Address input
2/10
FEDR27V802F-02-03
OKI Semiconductor
MR27V802F / P2ROM
FUNCTION TABLE
Mode
Read (16-Bit)
Read (8-Bit)
Output disable
Standby
CE#
L
L
L
H
OE#
L
L
H
∗
BYTE#
H
L
H
L
H
L
3.3V
D
OUT
V
CC
D0 to D7
D8 to D14
D
OUT
Hi–Z
Hi–Z
Hi–Z
L/H
∗
∗
D15/A–1
∗:
Don’t Care (H or L)
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating temperature under bias
Storage temperature
Input voltage
Output voltage
Power supply voltage
Power dissipation per package
Output short circuit current
Symbol
Ta
Tstg
V
I
V
O
V
CC
P
D
I
OS
Ta = 25°C
—
relative to V
SS
Condition
—
Value
0 to 70
–55 to 125
–0.5 to V
CC
+0.5
–0.5 to V
CC
+0.5
–0.5 to 5
1.0
10
Unit
°C
°C
V
V
V
W
mA
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70°C)
Parameter
V
CC
power supply voltage
Input “H” level
Input “L” level
Symbol
V
CC
V
IH
V
IL
V
CC
= 3.0 to 3.6 V
Condition
Min.
3.0
2.2
–0.5∗∗
Typ.
—
—
—
Max.
3.6
V
CC
+0.5∗
0.6
Unit
V
V
V
Voltage is relative to V
SS
.
∗
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗
: -1.5V(Min.) when pulse width of undershoot is less than 10ns.
PIN CAPACITANCE
(V
CC
= 3.3 V, Ta = 25°C, f = 1 MHz)
Parameter
Input
BYTE#
Output
Symbol
C
IN1
C
IN2
C
OUT
Condition
V
I
= 0 V
V
O
= 0 V
Min.
—
—
—
Typ.
—
—
—
Max.
8
100
10
pF
Unit
3/10
FEDR27V802F-02-03
OKI Semiconductor
MR27V802F / P2ROM
ELECTRICAL CHARACTERISTICS
DC Characteristics
(V
CC
= 3.0 V to 3.6 V , Ta = 0 to 70°C)
Parameter
Input leakage current
Output leakage current
V
CC
power supply current
(Standby)
V
CC
power supply current
(Read)
Input “H” level
Input “L” level
Output “H” level
Output “L” level
Symbol
I
LI
I
LO
I
CCSC
I
CCST
I
CCA
V
IH
V
IL
V
OH
V
OL
Condition
V
I
= 0 to V
CC
V
O
= 0 to V
CC
CE# = V
CC
CE# = V
IH
CE# = V
IL
, OE# = V
IH
tc = 200 ns
—
—
I
OH
= –1 mA
I
OL
= 2 mA
Min.
—
—
—
—
—
2.2
–0.5∗∗
2.4
—
Typ.
—
—
—
—
—
—
—
—
—
Max.
5
5
5
1
18
V
CC
+0.5∗
0.6
—
0.4
Unit
µA
µA
µA
mA
mA
V
V
V
V
Voltage is relative to V
SS
.
∗
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗
: -1.5V(Min.) when pulse width of undershoot is less than 10ns.
AC Characteristics
(V
CC
= 3.0 V to 3.6 V, Ta = 0 to 70°C)
Parameter
Address cycle time
Address access time
CE# access time
OE# access time
Output disable time
Output hold time
Symbol
t
C
t
ACC
t
CE
t
OE
t
CHZ
t
OHZ
t
OH
Condition
—
CE# = OE# = V
IL
OE# = V
IL
CE# = V
IL
OE# = V
IL
CE# = V
IL
CE# = OE# = V
IL
Min.
70
—
—
—
0
0
0
Max.
—
70
70
25
20
20
—
Unit
ns
ns
ns
ns
ns
ns
ns
Measurement conditions
Input signal level--------------------------------
0 V/3 V
Input timing reference level ------------------
1/2Vcc
Output load --------------------------------------
50 pF
Output timing reference level----------------
1/2Vcc
Output load
Output
50 pF
(Including scope and jig)
4/10
嵌入式系统
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