Standard SRAM, 1KX4, 2.5ns, ECL, CQFP24,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 最长访问时间 | 2.5 ns |
| 其他特性 | TEMP SPECIFIED AS TC |
| I/O 类型 | SEPARATE |
| JESD-30 代码 | S-GQFP-F24 |
| JESD-609代码 | e0 |
| 内存密度 | 4096 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 4 |
| 负电源额定电压 | -5.2 V |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 24 |
| 字数 | 1024 words |
| 字数代码 | 1000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 组织 | 1KX4 |
| 输出特性 | OPEN-EMITTER |
| 可输出 | NO |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | QFF |
| 封装等效代码 | QFL24,.4SQ |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 并行/串行 | PARALLEL |
| 电源 | -5.2 V |
| 认证状态 | Not Qualified |
| 最大压摆率 | 0.3 mA |
| 表面贴装 | YES |
| 技术 | ECL |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| SY101474-2.5FCF | SY10474-2.5MCF | SY10474-2.5FCF | SY101474-2.5MCF | SY100474-2.5MCF | SY100474-2.5FCF | |
|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 1KX4, 2.5ns, ECL, CQFP24, | Standard SRAM, 1KX4, 2.5ns, ECL, PQCC28, | Standard SRAM, 1KX4, 2.5ns, ECL, CQFP24, | Standard SRAM, 1KX4, 2.5ns, ECL, PQCC28, | Standard SRAM, 1KX4, 2.5ns, ECL, PQCC28, | Standard SRAM, 1KX4, 2.5ns, ECL, CQFP24, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 2.5 ns | 2.5 ns | 2.5 ns | 2.5 ns | 2.5 ns | 2.5 ns |
| 其他特性 | TEMP SPECIFIED AS TC | TEMP SPECIFIED AS TC | TEMP SPECIFIED AS TC | TEMP SPECIFIED AS TC | TEMP SPECIFIED AS TC | TEMP SPECIFIED AS TC |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | S-GQFP-F24 | S-PQCC-J28 | S-GQFP-F24 | S-PQCC-J28 | S-PQCC-J28 | S-GQFP-F24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
| 负电源额定电压 | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -4.5 V | -4.5 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 28 | 24 | 28 | 28 | 24 |
| 字数 | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| 字数代码 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 75 °C | 75 °C | 85 °C | 85 °C | 85 °C |
| 组织 | 1KX4 | 1KX4 | 1KX4 | 1KX4 | 1KX4 | 1KX4 |
| 输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| 可输出 | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | QFF | QCCJ | QFF | QCCJ | QCCJ | QFF |
| 封装等效代码 | QFL24,.4SQ | LDCC28,.5SQ | QFL24,.4SQ | LDCC28,.5SQ | LDCC28,.5SQ | QFL24,.4SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | CHIP CARRIER | FLATPACK | CHIP CARRIER | CHIP CARRIER | FLATPACK |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -4.5 V | -4.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 0.3 mA | 0.3 mA | 0.3 mA | 0.3 mA | 0.3 mA | 0.3 mA |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | ECL | ECL | ECL | ECL | ECL | ECL |
| 温度等级 | OTHER | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | J BEND | FLAT | J BEND | J BEND | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 厂商名称 | - | Synergy Semiconductor Corp | Synergy Semiconductor Corp | Synergy Semiconductor Corp | Synergy Semiconductor Corp | Synergy Semiconductor Corp |
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