IC SPECIALTY TELECOM CIRCUIT, PDIP8, 0.300 INCH, PLASTIC, DIP-8, Telecom IC:Other
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | DIP |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-8 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDIP-T8 |
| 长度 | 9.5 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | 225 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.2 mm |
| 最大压摆率 | 0.033 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 电信集成电路类型 | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |

| SA5212AN | SA5212AD-01118 | SA5212AD,602 | SA5212AD/01,112 | SA5212AD/01,118 | SA5212AFE | SA5212AD,623 | SA5212AD | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC SPECIALTY TELECOM CIRCUIT, PDIP8, 0.300 INCH, PLASTIC, DIP-8, Telecom IC:Other | Transimpedance Amplifiers FIBRE OPTIC | IC OPAMP TRANSIMP 140MHZ 8SO | IC OPAMP TRANSIMP 140MHZ 8SO | IC OPAMP TRANSIMP 140MHZ 8SO | IC SPECIALTY TELECOM CIRCUIT, CDIP8, 0.300 INCH, CERAMIC, DIP-8, Telecom IC:Other | IC SPECIALTY TELECOM CIRCUIT, PDSO8, PLASTIC, SO-8, Telecom IC:Other | IC SPECIALTY TELECOM CIRCUIT, PDSO8, PLASTIC, SO-8, Telecom IC:Other |
| 是否Rohs认证 | 不符合 | - | 符合 | 符合 | 符合 | 不符合 | - | 符合 |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | DIP | - | SOIC | SOIC | SOIC | DIP | SOIC | SOIC |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-8 | - | SOP, SOP8,.25 | PLASTIC, SO-8 | PLASTIC, SO-8 | 0.300 INCH, CERAMIC, DIP-8 | SOP, | PLASTIC, SO-8 |
| 针数 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | - | compliant | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDIP-T8 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-GDIP-T8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 9.5 mm | - | 4.9 mm | 4.9 mm | 4.9 mm | 9.955 mm | 4.9 mm | 4.9 mm |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | SOP | SOP | SOP | DIP | SOP | SOP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 225 | - | 260 | 260 | 260 | 225 | 260 | 260 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.2 mm | - | 1.75 mm | 1.75 mm | 1.75 mm | 5.08 mm | 1.75 mm | 1.75 mm |
| 标称供电电压 | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | - | YES | YES | YES | NO | YES | YES |
| 技术 | BIPOLAR | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 电信集成电路类型 | TELECOM CIRCUIT | - | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | - | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | 40 | 30 | 30 | NOT SPECIFIED | 40 | 40 |
| 宽度 | 7.62 mm | - | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm |
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