PROTECT HEADER RT ANG 20 CONTACT
| 74HC32 | 74HC32DB | 74HCT32DB | 74HCT32 | 74HCT32N | 74HCT32PW | 74HCT32D | 74HC32PW | 74HC32N | 74HC32D | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | PROTECT HEADER RT ANG 20 CONTACT | PROTECT HEADER RT ANG 20 CONTACT | PROTECT HEADER RT ANG 20 CONTACT | HEADER, 10 POS,0.100 C, DUAL, RT ANG | PROTECT HEADER RT ANG 20 CONTACT | PROTECT HEADER RT ANG 20 CONTACT | HCT SERIES, QUAD 2-INPUT OR GATE, PDSO14 | PROTECT HEADER RT ANG 20 CONTACT | HC/UH SERIES, QUAD 2-INPUT OR GATE, PDIP14 | HC/UH SERIES, QUAD 2-INPUT OR GATE, PDSO14 |
| 是否Rohs认证 | - | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | - | SSOP, SSOP14,.3 | SSOP, SSOP14,.3 | - | DIP, DIP14,.3 | TSSOP, TSSOP14,.25 | SOP, SOP14,.25 | TSSOP, TSSOP14,.25 | DIP, DIP14,.3 | SOP, SOP14,.25 |
| Reach Compliance Code | - | unknow | unknow | - | unknow | unknow | unknow | unknow | unknow | unknow |
| JESD-30 代码 | - | R-PDSO-G14 | R-PDSO-G14 | - | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 |
| 负载电容（CL） | - | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | OR GATE | OR GATE | - | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE |
| 最大I（ol） | - | 0.004 A | 0.004 A | - | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 端子数量 | - | 14 | 14 | - | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | - | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SSOP | SSOP | - | DIP | TSSOP | SOP | TSSOP | DIP | SOP |
| 封装等效代码 | - | SSOP14,.3 | SSOP14,.3 | - | DIP14,.3 | TSSOP14,.25 | SOP14,.25 | TSSOP14,.25 | DIP14,.3 | SOP14,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE |
| 包装方法 | - | TUBE | TUBE | - | TUBE | TUBE | TUBE | TUBE | TUBE | TUBE |
| 电源 | - | 2/6 V | 5 V | - | 5 V | 5 V | 5 V | 2/6 V | 2/6 V | 2/6 V |
| Prop。Delay @ Nom-Su | - | 27 ns | 36 ns | - | 36 ns | 36 ns | 36 ns | 27 ns | 27 ns | 27 ns |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | - | NO | NO | - | NO | NO | NO | NO | NO | NO |
| 表面贴装 | - | YES | YES | - | NO | YES | YES | YES | NO | YES |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | - | GULL WING | GULL WING | - | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | - | 0.635 mm | 0.635 mm | - | 2.54 mm | 0.635 mm | 1.27 mm | 0.635 mm | 2.54 mm | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
ARM技术
DSP 与 ARM 处理器
微控制器 MCU
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嵌入式系统
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