Dual buffer/line driver; 3-state
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | TSSOP, TSSOP8,.16 |
| Reach Compliance Code | unknow |
| 控制类型 | ENABLE LOW |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I(ol) | 0.006 A |
| 位数 | 1 |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.16 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 电源 | 2/6 V |
| Prop。Delay @ Nom-Su | 27 ns |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |

| 74HC2G125DP | 74HC2G125DC | 74HC2G125 | 74HCT2G125 | 74HCT2G125DP | |
|---|---|---|---|---|---|
| 描述 | Dual buffer/line driver; 3-state | Dual buffer/line driver; 3-state | Dual buffer/line driver; 3-state | Dual buffer/line driver; 3-state | Dual buffer/line driver; 3-state |
| 是否Rohs认证 | 不符合 | 符合 | - | - | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | - | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | TSSOP, TSSOP8,.16 | TSSOP, TSSOP8,.12,20 | - | - | TSSOP, TSSOP8,.16 |
| Reach Compliance Code | unknow | unknow | - | - | unknow |
| 控制类型 | ENABLE LOW | ENABLE LOW | - | - | ENABLE LOW |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | - | - | R-PDSO-G8 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | - | - | BUS DRIVER |
| 最大I(ol) | 0.006 A | 0.006 A | - | - | 0.006 A |
| 位数 | 1 | 1 | - | - | 1 |
| 功能数量 | 2 | 2 | - | - | 2 |
| 端子数量 | 8 | 8 | - | - | 8 |
| 最高工作温度 | 125 °C | 125 °C | - | - | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | - | - | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | - | - | 3-STATE |
| 输出极性 | TRUE | TRUE | - | - | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | - | - | TSSOP |
| 封装等效代码 | TSSOP8,.16 | TSSOP8,.12,20 | - | - | TSSOP8,.16 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | 2/6 V | 2/6 V | - | - | 5 V |
| Prop。Delay @ Nom-Su | 27 ns | 27 ns | - | - | 38 ns |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified |
| 表面贴装 | YES | YES | - | - | YES |
| 技术 | CMOS | CMOS | - | - | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | - | - | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | - | - | GULL WING |
| 端子节距 | 0.635 mm | 0.5 mm | - | - | 0.635 mm |
| 端子位置 | DUAL | DUAL | - | - | DUAL |
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