REVISIONS
LTR
DESCRIPTION
DATE
APPROVED
A
Removed vendor CAGE 61772 as source of supply for case outline
letter Z, the F-11A package. Added case outline letters U and T, F-11
and D-15 to the drawing. Editorial changes throughout.
Changes in accordance with NOR 5962-R042-95.
Updated boilerplate to reflect current requirements. Corrections to
pages 4, 5, 8 and timing waveforms. - glg
1990 OCT 04
M. A. Frye
B
C
94-12-15
01-01-17
M. A. Frye
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
C
15
C
16
REV
SHEET
PREPARED BY
Kenneth Rice
CHECKED BY
Ray Monnin
C
1
C
2
C
3
C
4
C
5
C
6
C
7
C
8
C
9
C
10
C
11
C
12
C
13
C
14
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY All DEPARTMENTS
APPROVED BY
Michael. A. Frye
MICROCIRCUITS, MEMORY, DIGITAL,
CMOS, PARALLEL 512 X 9 FIFO,
MONOLITHIC SILICON
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DRAWING APPROVAL DATE
23 May 1988
REVISION LEVEL
SIZE
C
A
SHEET
CAGE CODE
67268
1 OF
16
5962-87531
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E172-01
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
5962-87531
|
|
|
Drawing number
01
|
|
|
Device type
(see 1.2.1)
X
|
|
|
Case outline
(see 1.2.2)
X
|
|
|
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
02
03
Generic number
7201
7201
7201
Circuit
512 X 9-bit parallel FIFO
512 X 9-bit parallel FIFO
512 X 9-bit parallel FIFO
Access time
30 ns
50 ns
80 ns
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
Outline letter
X
Y
Z
U
T
Descriptive designator
GDIP1-T28 or CDIP2-T28
CQCC1-N32
CDFP3-F28
GDFP2-F28
GDIP4-T28 or CDIP3-T28
Terminals
28
32
28
28
28
Package style
dual-in-line package
rectangular chip carrier
flat package
flat package
dual-in-line package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings. 1/
Supply voltage range (V
CC
)..................................................
DC output current (I
OUT
).......................................................
Ambient storage temperature ..............................................
Temperature under bias .......................................................
Thermal resistance, junction-to-case (
"
JC
) ..........................
Maximum power dissipation (P
D
):.........................................
1.4 Recommended operating conditions. 1/
Supply voltage range (V
CC
)...................................................
Ground voltage (V
SS
) ............................................................
Minimum high level input voltage (V
IH
) .................................
Maximum low level input voltage (V
IL
) .................................
Case operating temperature range (T
C
) ...............................
Rise time ..............................................................................
Fall time................................................................................
+4.5 V dc to +5.5 V dc
0 V dc
2.0 V dc
0.8 V dc
-55
G
C to +125
G
C
5 ns
5 ns
-0.5 V dc to +7.0 V dc
50 mA
-65
G
C to +150
G
C
-55
G
C to +125
G
C
See MIL-STD-1835
1.0 W 2/
1/ All voltages referenced to V
SS
.
2/ Must withstand the added P
D
due to short circuit test; e.g., I
OS
.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
C
5962-87531
SHEET
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the
issue listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto,
cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-
38535 may be processed as QML product in accordance with the manufacturer's approved program plan and qualifying activity
approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A "Q" or "QML"
certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection
provided that each coated microcircuit inspection lot (see MIL-PRF-38535, appendix A) shall be subjected to and pass the
Internal Water-Vapor Content test (test method 1018 of MIL-STD-883). The frequency of the internal water vapor testing may
not be decreased unless approved by the preparing activity.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
C
5962-87531
SHEET
3
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For
packages where the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not
marking the "5962-" on the device.
3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535,
Appendix A.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,
appendix A.
3.9 Verification and review. DSCC, DSCC's agent and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test (method 1015 of MIL-STD-883).
(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or procuring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015 of MIL-STD-883.
(2) T
A
= +125
G
C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Subgroup 4 (C
IN
and C
OUT
measurement) shall be measured only for the initial test and after any design or process
changes which may affect capacitance. Sample size is 15 devices with no failures, and all input and output terminals
tested.
d. Subgroups 7 and 8 tests shall include verification of the truth table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
C
5962-87531
SHEET
4
TABLE I. Electrical performance characteristics.
|
|Symbol
|
|
|
|
|I
LI
|
|
|I
LO
|
|
|V
OL
|
|
|V
OH
|
|
|I
CC1
|
|
|
|I
CC2
|
|
|
|I
CC3
|
|
|
|C
I
|
|
|
|C
O
|
|
|
|
|
|
Conditions
|
-55
G
C < T
C
< +125
G
C
|
V
SS
= 0 V
|
4.5 V < V
CC
< 5.5 V
|
unless otherwise specified
|
|
0.4 V < V
IN
< V
CC
|
|
|
0.4 V < V
OUT
< V
CC
, R > V
IH
|
|
V
CC
= 4.5 V, I
OL
= 8.0 mA
|
V
IL
= 0.8 V, V
IH
= 2.2 V
|
|
V
CC
= 4.5 V, I
OH
= -2.0 mA
|
V
IL
= 0.8 V, V
IH
= 2.2 V
|
|
|
f = maximum, outputs open,
|
V
CC
= maximum
|
|
|
R = W = RS = FL/RT = V
IH
,
|
outputs open
|
|
|
All inputs = V
CC
- 0.2 V,
|
outputs open
|
|
|
V
I
= 5.0 V or GND, f = 1 MHz
|
T
C
= +25
G
C, See 4.3.1c
|
|
|
V
O
= 5.0 V or GND, f = 1 MHz
|
T
C
= +25
G
C, See 4.3.1c
|
|
|
See 4.3.1d.
|
|
|
|Group
A
|Device
|subgroups |
types
|
|
|
|
|
|
|1,
2, 3
|
All
|
|
|
|
|1,
2, 3
|
All
|
|
|
|
|1,
2, 3
|
All
|
|
|
|
|1,
2, 3
|
All
|
|
|
|
|1,
2, 3
|
All
|
|
|
|
|
|
|1,
2, 3
|
All
|
|
|
|
|
|
|1,
2, 3
|
All
|
|
|
|
|
|
|
4
|
All
|
|
|
|
|
|
|
4
|
All
|
|
|
|
|
|
|7,
8A, 8B
|
All
|
|
|
|
Limits
|
|
|
|
|
Min
|
Max
|
|
|
-10
|
10
|
|
|
|
|
-10
|
10
|
|
|
|
|
|
0.4
|
|
|
|
|
2.4
|
|
|
|
|
|
|
100
|
|
|
|
|
|
|
|
15
|
|
|
|
|
|
|
|
900
|
|
|
|
|
|
|
|
5
|
|
|
|
|
|
|
|
7
|
|
|
|
|
|
|
|
|
|
|
|
Unit
|
|
|
|
|
2
A
|
|
|
2
A
|
|
|
V
|
|
|
V
|
|
|
mA
|
|
|
|
mA
|
|
|
|
µA
|
|
|
|
pF
|
|
|
|
pF
|
|
|
|
|
Test
Input leakage current
Output leakage current
Output low voltage
Output high voltage
Operating supply
current
Standby power supply
current
Power down current
Input capacitance 1/
Output capacitance 1/
Functional tests
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
C
5962-87531
SHEET
5
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
