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BU4525AF

产品描述12A, 800V, NPN, Si, POWER TRANSISTOR
产品类别分立半导体    晶体管   
文件大小218KB,共2页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
下载文档 详细参数 选型对比 全文预览

BU4525AF概述

12A, 800V, NPN, Si, POWER TRANSISTOR

BU4525AF规格参数

参数名称属性值
厂商名称NXP(恩智浦)
Reach Compliance Codecompliant
外壳连接ISOLATED
最大集电极电流 (IC)12 A
集电极-发射极最大电压800 V
配置SINGLE
最小直流电流增益 (hFE)4.2
JESD-30 代码R-PSFM-T3
元件数量1
端子数量3
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式FLANGE MOUNT
极性/信道类型NPN
功耗环境最大值45 W
最大功率耗散 (Abs)45 W
认证状态Not Qualified
表面贴装NO
端子形式THROUGH-HOLE
端子位置SINGLE
晶体管应用SWITCHING
晶体管元件材料SILICON
VCEsat-Max3 V

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Crop here for Mid-Atlantic paper size
DISCRETE SEMICONDUCTORS
Fact Sheet 079
High-quality glass-passivated diodes
(Implotec)
BYD33J competitor investigation
This publication offers a direct comparison between Philips
Semiconductors’ glass-passivated BYD33J diode family (based on
the company’s proprietary Implotec technology) and two major
competitor products. The comparison highlights major advantages
of the Philips technology, including high reliability and excellent
thermal performance with no tendency toward delamination at the lead-
package interfaces.
Philips’ BYD33J
Package
Glass Implotec SOD81
Comparable competitor I
Plastic DO-41
Comparable competitor II
Glass plastic DO-41
Electrical
Glass passivated
High maximum operating temperature
(T
jmax
= 175 °C)
Low leakage current (typ. I
R
= 8.0 µA,
T
a
= 150 °C)
Excellent stability (zero defects in
259k device hours)
Guaranteed avalanche energy
absorption capability (E
RSM
to
destruction = 16 mJ )
Silicon rubber passivation
Low max operating temperature
(T
jmax
= 125 °C)
Higher leakage current due to
passivation (typ. I
R
= 275 µA,
T
a
= 150 °C)
Poor stability although level of
instability is just acceptable
Lower capability to withstand reverse
energy (E
RSM
to destruction = 2 mJ)
Glass bead moulded in plastic or
passivated chip
Lower max operating temperature
(T
jmax
= 150 °C)
Comparable leakage current
(typ. I
R
= 10 µA, T
a
= 150 °C)
Stability is acceptable
Lower capability to withstand reverse
energy (E
RSM
to destruction = 10 mJ)
Mechanical
Excellent pressure contacts due to
Implotec technology
Not sensitive to moisture,
hermetically sealed — no rejects on
humidity tests
Fatigue free because coefficients of
expansion of all used parts are
matched
Excellent thermal-fatigue performance
— no rejects in fatigue tests
Low temperature soldering
construction
Sensitive to moisture, plastic is
hygroscopic, delamination after
moulding
Plastic coefficient of expansion does
not match with the other parts,
resulting in delamination
Often rejects, chip cracks due to
coefficients of expansion
Low temperature soldering
construction
Glass-plastic is still sensitive to
moisture
With glass-plastic, delaminations are
still seen
Better than just plastic but not as good
as glass Implotec

BU4525AF相似产品对比

BU4525AF BU4525AX
描述 12A, 800V, NPN, Si, POWER TRANSISTOR 12A, 800V, NPN, Si, POWER TRANSISTOR
厂商名称 NXP(恩智浦) NXP(恩智浦)
Reach Compliance Code compliant unknown
外壳连接 ISOLATED ISOLATED
最大集电极电流 (IC) 12 A 12 A
集电极-发射极最大电压 800 V 800 V
配置 SINGLE SINGLE
最小直流电流增益 (hFE) 4.2 4.2
JESD-30 代码 R-PSFM-T3 R-PSFM-T3
元件数量 1 1
端子数量 3 3
最高工作温度 150 °C 150 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR
封装形式 FLANGE MOUNT FLANGE MOUNT
极性/信道类型 NPN NPN
功耗环境最大值 45 W 45 W
最大功率耗散 (Abs) 45 W 45 W
认证状态 Not Qualified Not Qualified
表面贴装 NO NO
端子形式 THROUGH-HOLE THROUGH-HOLE
端子位置 SINGLE SINGLE
晶体管应用 SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON
VCEsat-Max 3 V 3 V
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