Arithmetic Logic Unit, ECL10K, PDIP24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Motorola ( NXP ) |
Reach Compliance Code | unknown |
Is Samacsys | N |
JESD-30 代码 | R-PDIP-T24 |
JESD-609代码 | e0 |
逻辑集成电路类型 | ARITHMETIC LOGIC UNIT |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -30 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP24,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | -5.2 V |
表面贴装 | NO |
技术 | ECL10K |
温度等级 | OTHER |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
MC10181P1 | MC10181PS | MC10181PDS | MC10181PD | MC10181LS | MC10181LD | MC10181L1 | |
---|---|---|---|---|---|---|---|
描述 | Arithmetic Logic Unit, ECL10K, PDIP24 | Arithmetic Logic Unit, ECL10K, PDIP24 | Arithmetic Logic Unit, ECL10K, PDIP24 | Arithmetic Logic Unit, ECL10K, PDIP24 | Arithmetic Logic Unit, ECL10K, CDIP24 | Arithmetic Logic Unit, ECL10K, CDIP24 | Arithmetic Logic Unit, ECL10K, CDIP24 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT |
端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | ECL10K | ECL10K | ECL10K | ECL10K | ECL10K | ECL10K | ECL10K |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Is Samacsys | N | N | N | N | - | - | - |
Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |
包装说明 | - | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | - | - |
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