REVISIONS
LTR
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
DESCRIPTION
Change T
A
to T
C
; Minor corrections to table I; rewrite para 3.7; Change
vendor.
Reinstate vendor, FSCM 27014.
Modify para 3.7; general update.
Add vendors FSCM's 63071 and 64762. Remove vendor FSCM 27014.
Editorial changes throughout.
Add vendor FSCM 27014.
Convert to military format. Change CAGE to 67268. Add vendor's CAGES
23223 and 34031.
Made technical change to 1.3. Removed CAGE 63071. Made editorial
changes throughout. Changed to reflect MIL-H-38534 processing.
Corrections to table I. Update document. Editorial changes throughout.
Changes in accordance with NOR 5962-R195-93.
Changes in accordance with NOR 5962-R266-94.
Changes in accordance with NOR 5962-R102-96.
Changes IAW NOR 5962-R195-93, 5962-R266-94, and 5962-R102-96. Entire
document redrawn.
Remove CAGE codes 23223 and 64762. Changes to table I.
Updated drawing to the latest requirements. -sld
Table I, supply voltage rejection ratios test, Group A subgroups column, add
"1, 2, 3 or". Output voltage swing (maximum) test: Delete "(maximum)" and for
the Group A subgroups column, add "or 4, 5, 6".
DATE (YR-MO-DA)
82-03-30
82-05-14
83-08-03
84-12-14
85-12-03
88-01-14
90-01-08
92-06-26
93-06-22
94-08-17
96-04-15
96-08-02
98-06-22
05-04-04
06-03-27
APPROVED
N. A. Hauck
W. E. Shoup
N. A. Hauck
N. A. Hauck
N. A. Hauck
W. Heckman
W. Heckman
G. A. Lude
K. A. Cottongim
K. A. Cottongim
K. A. Cottongim
Raymond Monnin
K. A. Cottongim
Raymond Monnin
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
CURRENT CAGE CODE 67268
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
C.R. Jackson
CHECKED BY
William E. Shoup
R
1
R
2
R
3
R
4
R
5
R
6
R
7
R
8
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
POST OFFICE BOX 3990
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
N.A Hauck
MICROCIRCUIT, HYBRID, LINEAR,
OPERATIONAL AMPLIFIER, THICK FILM
DRAWING APPROVAL DATE
80-12-22
REVISION LEVEL
R
SIZE
A
SHEET
CAGE CODE
14933
1 OF
8
80013
DSCC FORM 2233
APR 97
5962-E116-06
1. SCOPE
1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to processed in accordance with MIL-
PRF-38534.
1.2 PIN. The PIN shall be as shown in the following example:
80013
⎪
⎪
⎜
Drawing number
01
⎪
⎪
⎪
Device type
(see 1.2.1)
Z
⎪
⎪
⎪
Case outline
(see 1.2.2)
C
⎪
⎪
⎪
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
MSK0032B
Circuit function
Operational amplifier
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Z
Descriptive designator
See figure 1
Terminals
12
Package style
Can
1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage range ..................................................................
Input voltage range .....................................................................
Maximum power dissipation (P
D
), T
A
= +25°C ............................
Storage temperature range.........................................................
Lead temperature (soldering, 10 seconds) .................................
Junction temperature (T
J
) ...........................................................
1.4 Recommended operating conditions.
Supply voltage (V
S
) .....................................................................
Ambient operating temperature range (T
A
) .................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
±15 V dc
-55°C to +125°C
±18 V dc maximum
±18 V dc
1.5 W 2/ 3/
-65°C to +150°C
+300°C
+150°C
1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ No heat sink.
3/ Derate at 10 mW per
°C.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
A
REVISION LEVEL
R
80013
SHEET
2
DSCC FORM 2234
APR 97
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with MIL-
PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device
manufacturer's Quality Management (QM) plan or as designated for applicable device class. The manufacturer may eliminate,
modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall
be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the
device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
R
80013
SHEET
3
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
R
L
= 100 kΩ, V
IN
= 0 V
Group A
subgroups
1
2,3
Input voltage range 2/
Input offset current
V
CM
I
IO
V
IN
= 0 V
1,2,3
1
2,3
Input bias current
I
IB
V
IN
= 0 V
1
2,3
Supply current
Supply voltage rejection
ratios
Large signal voltage 2/ 3/
gain
Input voltage common-
mode rejection ratio
Input offset voltage
temperature coefficient
Output voltage swing
I
CC
SVRR(±)
I
O
= 0 mA, T
A
= +25°C
±5 V
≤
V
S
≤
±20 V
R
L
= 1 kΩ, V
OUT
= ±10 V
1
1,2,3
or
4,5,6
4
5,6
CMRR
∆V/∆T
∆V
IN
= ±10 V
4,5,6
1,2,3
1,2,3
or
4,5,6
4,5,6
01
01
01
±10
01
01
50
01
01
01
±10
0.025
25
0.1
50
20
mA
dB
nA
Device
type
01
Limits
Min
Max
5.0
10.0
V
nA
Unit
Input offset voltage
V
IO
mV
A
VS
(±)
01
48
45
50
50
dB
dB
µV/°C
V
V
OP
R
L
= 1 kΩ
Voltage gain
A
V
R
L
= 1 kΩ, V
OUT
= ±10 V,
f = 1 kHz
R
L
= 1 kΩ, A
V
= +1,
∆V
IN
= 20 V, T
A
= +25°C
A
V
= +1, R
L
= 1 kΩ,
T
A
= +25°C
A
V
= +1, R
L
= 1 kΩ,
∆V
IN
= 1 V, T
A
= +25°C
A
V
= -1, R
L
= 1 kΩ,
∆V
IN
= 20 V, T
A
= +25°C
01
57
dB
Slew rate
SR
4
01
350
V/µs
Small signal rise time
t
r
t
d
t
SET
9
01
20
ns
Small signal delay time
9
01
25
ns
Settling time to 1 percent
of final value 2/
9
01
0.5
µs
1/ V
S
= ±15.0 V dc.
2/ Parameter shall be guaranteed to the limits specified in table I for all lots not specifically tested.
3/ Subgroups 5 and 6 shall be tested as part of device initial characterization and after design and process changes.
Parameter shall be guaranteed to the limits specified for subgroups 5 and 6 for all lots not specifically tested.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
R
80013
SHEET
4
DSCC FORM 2234
APR 97
Case Z
Symbol
Inches
Min
Max
.181
.019
.021
.610
.555
Millimeters
Min
3.30
0.41
0.41
15.11
13.84
Max
4.60
0.48
0.53
15.49
15.37
Notes
Symbol
Inches
Min
Max
.030
.036
.036
.560
.050
----
.045
Millimeters
Min
0.56
0.66
0.66
12.70
----
6.35
Max
0.76
0.91
0.91
14.22
1.27
----
1.14
45° BSC
Notes
A
φb
φb
1
φD
φD
1
e
e1
e2
.130
.016
.016
.595
.545
F
2, 6
2, 6
k
k1
L
L1
4
4
4
L2
Q
α
.022
.026
.026
.500
----
.250
----
3
2
2
2
.400 BSC
.200 BSC
.100 BSC
10.16 BSC
5.08 BSC
2.54 BSC
45° BSC
NOTES:
1. The U.S. government preferred system of measurement is the metric SI system. However, this item was originally
designed using inch-pound units of measurement. In the event of conflict between the metric and inch-pound units, the
inch-pound units shall take precedence.
2. All leads
φb
applies between L1 and L2.
φb
1
applies between L2 and .500 (12.70 mm) from the reference plane.
Diameter is uncontrolled in L1 and beyond .500 (12.70 mm) from the reference plane.
3. Measured from the maximum diameter of the product.
4. Leads having a maximum diameter .019 (0.48 mm) measured in gauging plane .054 (1.37 mm) +.001 (0.03 mm)
-.000 (0.00 mm) below the base plane of the product shall be within .007 (0.18 mm) of their true position relative to a
maximum tab width.
5. The product may be measured by direct methods or by gauge.
6. All leads: Increase maximum limit by .003 (0.08 mm) when lead finish A is applied.
FIGURE 1. Case outline.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
R
80013
SHEET
5
DSCC FORM 2234
APR 97
stm32/stm8
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
