1.25 Gbps Single Mode SFF LC Transceiver
C-1xx-1250(C)-FDFB-SLCx
Features
• Duplex LC Single Mode Transceiver
• Small Form Factor Multi-sourced 2x5 Pin Package
• Complies with IEEE 802.3 Gigabit Ethernet
• 1270 nm to1610 nm Wavelength, CWDM DFB Laser
• Single +3.3V Power Supply
• LVPECL Differential Inputs and Outputs
• LVTTL Signal Detection Output (C-1xx-1250C-FDFB-SLCx)
• LVPECL Signal Detection Output (C-1xx-1250-FDFB-SLCx)
• Temperature Range: 0 to 70 ºC
• Class 1 Laser International Safety Standard IEC 825 compliant
• Solderability to MIL-STD-883, Method 2003
• Pin Coating is Sn/Pb with minimum 2% Pb content
• Flammability to UL94V0
• Humidity RH 5-85% (5-90% short term) to IEC 68-2-3
• Complies with Bellcore GR-468-CORE
• Uncooled laser diode with MQW structure
• 1.25 Gbps Ethernet Links application
• 1.06 Gbps Fiber Channel application
• RoHS compliance available
Absolute Maximum Rating
Parameter
Power Supply Voltage
Output Current
Soldering Temperature
Operating Temperature
Storage Temperature
Recommended Operating Condition
Parameter
Power Supply Voltage
Operating Temperature (Case)
Data rate
Symbol
V
cc
T
opr
Min.
3.1
0
-
Typ.
3.3
-
1250
Max.
3.5
70
-
Unit
V
ºC
Mbps
Symbol
V
cc
I
out
-
T
opr
T
stg
Min.
0
0
-
0
-40
Max.
3.6
30
260
70
85
Unit
V
mA
ºC
ºC
ºC
10 seconds on leads only
Note
Transmitter Specifications
Parameter
Optical
Optical Transmit Power
Optical Transmit Power
Optical Transmit Power
Output center Wavelength
Output Spectrum Width
Side Mode Suppression Ratio
Extinction Ratio
Output Eye
Optical Rise Time
Optical Fall Time
Relative Intensity Noise
Total Jitter
LUMINENTOIC.COM
tr
tf
RIN
TJ
P
o
P
o
P
o
λ
∆λ
Sr
ER
-5
-3
0
λ
p-5.5
-
30
9
-
-
-
-
-
-
-
λ
p
-
35
-
-
-
-
-
0
+2
+5
λ
p+7.5
1
-
-
0.26
0.26
-120
0.27
dBm
dBm
dBm
nm
nm
dBm
dB
ns
ns
dB/Hz
ns
Measured with 2
7
-1 PRBS
LUMNDS771-Nov2707
Rev A.1
20% to 80% Values
20% to 80% Values
C-1xx-1250(C)-FDFB-SLC2
C-1xx-1250(C)-FDFB-SLC3
C-1xx-1250(C)-FDFB-SLC4
λ
p=1XX0 nm, C-1xx-1250(C)-FDFB-SLCx
-20 dB width
CW, P
o
=5mW
Symbol
Min
Typical
Max
Unit
Notes
Compliant with IEEE 802.3
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
1
1.25 Gbps Single Mode SFF LC Transceiver
C-1xx-1250(C)-FDFB-SLCx
Transmitter Specifications
Parameter
Electrical
Power Supply Current
Transmit Enable Voltage
Transmit Disable Voltage
Data Input Current-Low
Data Input Current-High
Data Input Voltage-Low
Data Input Voltage-High
I
CC
VEN
VD
Symbol
Min
Typical
Max
Unit
Notes
Maximum current is specified at Vcc=
Maximum @ maximum temperature
-
0
2.0
-200
-
-2.0
-1.1
-
-
-
-
-
-
-
180
0.8
Vcc
-
200
-1.58
-0.74
mA
V
V
µA
µA
V
V
I
IL
I
IH
V
IL
-V
CC
V
IH
-V
CC
These inputs are compatible with 10K,
10KH and 100K ECL and PECL inputs
Receiver Specifications
Parameter
Optical
Sensitivity
Maximum Input Power
Signal Detect-Asserted
Signal Detect-Deasserted
Signal Detect-Hysteresis
Wavelength of Operation
-
P
in
Pa
Pd
-
-3
-
-38
1.0
1100
-
-
-
-
-
-
-22
-
-22
-
-
1620
dBm
dBm
dBm
dBm
dB
nm
Measured on transition: low to high
Measured on transition: high to low
Measured with 2
7
-
1 PRBS, BER = 10
-12
Symbol
Min
Typical
Max
Unit
Notes
Receiver Specifications
Parameter
Electrical
Power Supply Current
Data Output Voltage-Low
Data Output Voltage-High
Signal Detect Output Voltage-Low
Signal Detect Output Voltage-High
Signal Detect Output Voltage-Low
Signal Detect Output Voltage-High
I
CC
V
OL
-V
cc
V
OH
-
V
cc
V
SDL-
V
cc
V
SDH-
V
cc
V
SDL-
V
cc
V
SDH-
V
cc
-
-2
-1.1
-2
-1.1
-
2.0
-
-
-
-
-
-
-
120
-1.58
-0.74
-1.58
-0.74
0.5
-
mA
V
V
V
V
V
V
The current excludes the output load current
These outputs are compatible with 10K,
10KH and 100K ECL and LVPECL outputs
C-1xx-1250-FDFB-SLCx
C-1xx-1250C-FDFB-SLCx
Symbol
Min
Typical
Max
Unit
Note
LUMINENTOIC.COM
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
2
LUMNDS771-Nov2707
Rev A.1
1.25 Gbps Single Mode SFF LC Transceiver
C-1xx-1250(C)-FDFB-SLCx
Connection Diagram
Legal Notice
PIN
1
2
3
4
5
6
7
8
9
10
Symbol
RxGND
TxVcc
SD
RD-
RD+
TxVcc
TxGND
TxDIS
TD+
TD-
Notes
Directly connect this pin to the receiver ground plane
+3.3 V dc power for the receiver section
Active high on this indicates a received optical signal(LVPECL/LVTTL)
Receiver Data Out Bar (LVPECL)
Receiver Dat Out (LVPECL)
+3.3 V dc power for the transmitter section
Directly connect this pin to the transmitter ground plane
Transmitter disable (LVTTL)
Transmitter Data In (LVPECL)
Transmitter Data In Bar (LVPECL)
The attaching posts are at case potential and may be connected to chassis
ground. They are isolated from circuit ground.
Attaching Posts
LUMINENTOIC.COM
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
3
LUMNDS771-Nov2707
Rev A.1
1.25 Gbps Single Mode SFF LC Transceiver
C-1xx-1250(C)-FDFB-SLCx
Recommended Circuit Schematic
C-1xx-1250-FDFB-SLCx
PHY DEVICE
TERMINATE AT
TRANSCEIVER INPUTS
Vcc(+3.3V)
Z=50
½
TD-
100
½
LVPECL
Z=50
½
130
½
TD+
130
½
Tx Disable
LVTTL
10
TD-
9
TD+
8
TxDIS
7
TxGND
6
1
½
H
Vcc(+3.3V)
C3
TxVcc
Tx
Rx
C2
10
½
F
RxGND
RxVcc
RD+
RD-
SD
1
½
H
C1
Vcc(+3.3V)
RD+
1
2
3
4
5
Z=50
½
100
½
RD-
LVPECL
Z=50
½
130
½
130
½
Z=50
½
Vcc(+3.3V)
130
½
SD
LVPECL
82
½
NOTE:C1=C2=C3=100nF
TERMINATE AT
DEVICE INPUTS
C-1xx-1250C-FDFB-SLCx
TERMINATE AT
TRANSCEIVER INPUTS
Z=50
½
TD-
PHY DEVICE
Vcc(+3.3V)
100
½
LVPECL
Z=50
½
130
½
TD+
130
½
Tx Disable
LVTTL
10
TD-
9
TD+
8
TxDIS
7
TxGND
6
1
½
H
Vcc(+3.3V)
C3
TxVcc
Tx
Rx
C2
10
½
F
RxGND
RxVcc
RD+
RD-
SD
1
½
H
C1
Vcc(+3.3V)
RD+
1
2
3
4
5
Z=50
½
100
½
RD-
LVPECL
Z=50
½
Vcc(+3.3V)
Z=50
½
SD
LVTTL
NOTE:C1=C2=C3=100nF
TERMINATE AT
DEVICE INPUTS
The split-loaded terminations for ECL signals need to be located at the input of devices receiving those ECL signals.
The power supply filtering is required for good EMI performance. Use short tracks from the inductor L1/L2 to the module Rx Vcc and Tx Vcc.
A GND plane under the module is required for good EMI and sensitivity performance.
LUMINENTOIC.COM
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
LUMNDS771-Nov2707
Rev A.1
4
1.25 Gbps Single Mode SFF LC Transceiver
C-1xx-1250(C)-FDFB-SLCx
Package Diagram
(1.921)
+(
)
-(0.008)
(0.535)
+(
)
-(0.004)
(0.
)
(0.520)
(0.
)
(0.
)
(0.386)
+(
)
-(0.004)
(0.374)
(0.
)
(0.086)
(0.
)
(0.400)
(0.386)
(0.150)
(0.020)
(0.070)
(0.413)
(0.039)±(0.002)
(0.700)
(0.280)
(0.200)
(0.246)
Units in mm(inch)
Printed Circuit Board Layout Consideration
A fiber-optic receiver employs a very high gain, wide bandwidth transimpedance amplifier. This amplifier detects and amplifies
signals that are only tens of nA in amplitude when the receiver is operating near it’s limit. Any unwanted signal current that couples into the
receiver circuitry causes a decrease in the receiver’s sensitivity and can also degrade the performance of the receiver’s signal detect (SD) circuit.
To minimize the coupling of unwanted noise into the receiver, careful attention must be given to the printed circuit board.
At a minimum, a double-sided printed circuit board(PCB) with a large component side ground plane beneath the transceiver must
be used. In applications that include many other high speed devices, a multi-layer PCB is highly recommended. This permits the placement of
power and ground on separate layers, wich allows them to be isolated from the signal lines. Multilayer construction also permits the routing of
signal traces away from high level, high speed sinal lines. To minimize the possibility of coupling noise into the receiver section, high level, high
speed signals such as transmitter inputs and clock lines should be routed as far away as possible from the receiver pins.
Noise that couples into the receiver through the power supply pins can also degrade performance. It is recommended that a pi filter
be used in both transmitter and receiver power supplies.
EMI and ESC Consideration
LuminentOIC transceivers offer a metalized plastic case and a special chassis grounding clip. As shown in the drawing, this clip connects
the module case to chassis ground then installs flush through the panel cutout. This way, the grounding clip brushes the edge of the cutout in
order to make a proper contact. The use of a grounding clip also provides increased electrostatic protection and helps reduce radiated emission
from the module or the host circuit board through the chassis faceplate. The attaching posts are at case potential and may be connected to chassis
ground. They should not be connected to circuit ground.
Plastic optical subassemblies are used to further reduce the possibility of radiated emission by eliminating the metal from the
transmitter and receiver diode housings, which extend into connector space. By providing a non-metal receptacle for the optical cable ferrule, the
gigabit speed RF electrical signal is isolated from the connector area thus preventing radiated energy leakage from these surfaces to the outside of
the panel.
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
LUMINENTOIC.COM
5
LUMNDS771-Nov2707
Rev A.1
NXP MCU
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