Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDSO16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | SOP, SOP16,.25 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 湿度敏感等级 | 1 |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最大通态电阻 (Ron) | 225 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 2/6,GND/-6 V |
| 认证状态 | Not Qualified |
| 最大信号电流 | 0.025 A |
| 表面贴装 | YES |
| 最长接通时间 | 225 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 74HC4051D | 74HCT4051DB | 74HCT4051D | 74HC4051PW | 74HC4051DB | |
|---|---|---|---|---|---|
| 描述 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDSO16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDSO16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDSO16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDSO16 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDSO16 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | SOP, SOP16,.25 | SSOP, SSOP16,.3 | SOP, SOP16,.25 | TSSOP, TSSOP16,.25 | SSOP, SSOP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| 信道数量 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 最大通态电阻 (Ron) | 225 Ω | 270 Ω | 225 Ω | 270 Ω | 270 Ω |
| 最高工作温度 | 85 °C | 125 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SSOP | SOP | TSSOP | SSOP |
| 封装等效代码 | SOP16,.25 | SSOP16,.3 | SOP16,.25 | TSSOP16,.25 | SSOP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 电源 | 2/6,GND/-6 V | 2/10 V | 5,GND/-5 V | 2/10 V | 2/10 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大信号电流 | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A |
| 表面贴装 | YES | YES | YES | YES | YES |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.635 mm | 1.27 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 最大供电电流 (Isup) | - | 0.32 mA | - | 0.32 mA | 0.32 mA |
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