|
CD74HC4351M96 |
CD74HCT4351E |
CD74HC4352E |
CD74HC4351ME4 |
CD74HC4351M |
CD74HC4351E |
CD74HC4351EE4 |
CD74HC4351EG4 |
| 描述 |
High Speed CMOS Logic 8-Channel Analog Multiplexers/Demultiplexers with Latch 20-SOIC -55 to 125 |
High Speed CMOS 8-Channel Analog Multiplexer/Demultiplexer with Latch 20-PDIP -55 to 125 |
High Speed CMOS Logic Dual 4-Channel Analog Multiplexers/Demultiplexers with Latch 20-PDIP -55 to 125 |
High Speed CMOS Logic 8-Channel Analog Multiplexers/Demultiplexers with Latch 20-SOIC -55 to 125 |
High Speed CMOS Logic 8-Channel Analog Multiplexers/Demultiplexers with Latch 20-SOIC -55 to 125 |
High Speed CMOS Logic 8-Channel Analog Multiplexers/Demultiplexers with Latch 20-PDIP -55 to 125 |
High Speed CMOS Logic 8-Channel Analog Multiplexers/Demultiplexers with Latch 20-PDIP -55 to 125 |
IC MUX/DEMUX 8X1 20DIP |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
| 是否无铅 |
不含铅 |
不含铅 |
不含铅 |
- |
不含铅 |
不含铅 |
不含铅 |
- |
| 是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
- |
| 厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
- |
| 零件包装代码 |
SOIC |
DIP |
DIP |
SOIC |
SOIC |
DIP |
DIP |
- |
| 包装说明 |
SOIC-20 |
DIP, DIP20,.3 |
DIP, DIP20,.3 |
SOP, SOP20,.4 |
SOIC-20 |
DIP-20 |
DIP, DIP20,.3 |
- |
| 针数 |
20 |
20 |
20 |
20 |
20 |
20 |
20 |
- |
| Reach Compliance Code |
compliant |
compli |
compli |
compli |
compliant |
compliant |
compli |
- |
| Factory Lead Time |
1 week |
1 week |
6 weeks |
1 week |
1 week |
1 week |
6 weeks |
- |
| 其他特性 |
ALSO OPERATES AT 2V TO 10V (VCC-VEE) SUPPLY |
ALSO OPERATES AT 2V TO 10V (VCC-VEE) SUPPLY |
ALSO OPERATES AT 2V TO 10V (VCC-VEE) SUPPLY |
ALSO OPERATES AT 2V TO 10V (VCC-VEE) SUPPLY |
ALSO OPERATES AT 2V TO 10V (VCC-VEE) SUPPLY |
ALSO OPERATES AT 2V TO 10V (VCC-VEE) SUPPLY |
ALSO OPERATES AT 2V TO 10V (VCC-VEE) SUPPLY |
- |
| 模拟集成电路 - 其他类型 |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
- |
| 标称带宽 |
180 MHz |
180 MHz |
185 MHz |
- |
180 MHz |
180 MHz |
180 MHz |
- |
| 最大输入电压 |
6 V |
10 V |
6 V |
- |
6 V |
6 V |
6 V |
- |
| 最小输入电压 |
2 V |
- |
2 V |
- |
2 V |
2 V |
2 V |
- |
| JESD-30 代码 |
R-PDSO-G20 |
R-PDIP-T20 |
R-PDIP-T20 |
R-PDSO-G20 |
R-PDSO-G20 |
R-PDIP-T20 |
R-PDIP-T20 |
- |
| JESD-609代码 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
- |
| 长度 |
12.8 mm |
25.4 mm |
25.4 mm |
12.8 mm |
12.8 mm |
25.4 mm |
25.4 mm |
- |
| 标称负供电电压 (Vsup) |
-4.5 V |
- |
-4.5 V |
-4.5 V |
-4.5 V |
-4.5 V |
-4.5 V |
- |
| 正常位置 |
NC |
- |
NC |
- |
NC |
NC |
NC |
- |
| 信道数量 |
1 |
1 |
2 |
8 |
1 |
1 |
1 |
- |
| 功能数量 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
- |
| 端子数量 |
20 |
20 |
20 |
20 |
20 |
20 |
20 |
- |
| 标称断态隔离度 |
73 dB |
73 dB |
65 dB |
73 dB |
73 dB |
73 dB |
73 dB |
- |
| 通态电阻匹配规范 |
10 Ω |
10 Ω |
10 Ω |
10 Ω |
10 Ω |
10 Ω |
10 Ω |
- |
| 最大通态电阻 (Ron) |
240 Ω |
240 Ω |
240 Ω |
240 Ω |
240 Ω |
240 Ω |
240 Ω |
- |
| 最高工作温度 |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
- |
| 最低工作温度 |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
- |
| 输出 |
COMMON OUTPUT |
COMMON OUTPUT |
COMMON OUTPUT |
- |
COMMON OUTPUT |
COMMON OUTPUT |
COMMON OUTPUT |
- |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
| 封装代码 |
SOP |
DIP |
DIP |
SOP |
SOP |
DIP |
DIP |
- |
| 封装等效代码 |
SOP20,.4 |
DIP20,.3 |
DIP20,.3 |
SOP20,.4 |
SOP20,.4 |
DIP20,.3 |
DIP20,.3 |
- |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
| 封装形式 |
SMALL OUTLINE |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE |
IN-LINE |
IN-LINE |
- |
| 峰值回流温度(摄氏度) |
260 |
NOT SPECIFIED |
NOT SPECIFIED |
260 |
260 |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| 电源 |
2/6,GND/-6 V |
5 V |
2/6,GND/-6 V |
2/6,GND/-6 V |
2/6,GND/-6 V |
2/6,GND/-6 V |
2/6,GND/-6 V |
- |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
| 座面最大高度 |
2.65 mm |
5.08 mm |
5.08 mm |
2.65 mm |
2.65 mm |
5.08 mm |
5.08 mm |
- |
| 最大信号电流 |
0.025 A |
0.025 A |
0.025 A |
0.025 A |
0.025 A |
0.025 A |
0.025 A |
- |
| 最大供电电流 (Isup) |
0.08 mA |
0.08 mA |
0.08 mA |
0.16 mA |
0.08 mA |
0.08 mA |
0.08 mA |
- |
| 最大供电电压 (Vsup) |
6 V |
5.5 V |
6 V |
6 V |
6 V |
6 V |
6 V |
- |
| 最小供电电压 (Vsup) |
2 V |
4.5 V |
2 V |
2 V |
2 V |
2 V |
2 V |
- |
| 标称供电电压 (Vsup) |
4.5 V |
5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
- |
| 表面贴装 |
YES |
NO |
NO |
YES |
YES |
NO |
NO |
- |
| 最长断开时间 |
375 ns |
375 ns |
415 ns |
375 ns |
375 ns |
375 ns |
375 ns |
- |
| 最长接通时间 |
450 ns |
450 ns |
525 ns |
450 ns |
450 ns |
450 ns |
450 ns |
- |
| 切换 |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
- |
| 技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
- |
| 温度等级 |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
- |
| 端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
| 端子形式 |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
- |
| 端子节距 |
1.27 mm |
2.54 mm |
2.54 mm |
1.27 mm |
1.27 mm |
2.54 mm |
2.54 mm |
- |
| 端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
- |
| 处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| 宽度 |
7.5 mm |
7.62 mm |
7.62 mm |
7.5 mm |
7.5 mm |
7.62 mm |
7.62 mm |
- |
| Base Number Matches |
1 |
1 |
1 |
- |
1 |
1 |
- |
- |