74HC4351; 74HCT4351 - 8-channel analog multiplexer/demultiplexer with latch SOP 20-Pin
参数名称 | 属性值 |
Brand Name | Nexperia |
是否Rohs认证 | 符合 |
厂商名称 | Nexperia |
零件包装代码 | SOP |
包装说明 | SOT-163, SO-20 |
针数 | 20 |
制造商包装代码 | SOT163-1 |
Reach Compliance Code | compliant |
Factory Lead Time | 4 weeks |
Samacsys Confidence | 2 |
Samacsys Status | Released |
Samacsys PartID | 423334 |
Samacsys Pin Count | 20 |
Samacsys Part Category | Integrated Circuit |
Samacsys Package Category | Small Outline Packages |
Samacsys Footprint Name | SO20 |
Samacsys Released Date | 2019-11-12 07:41:52 |
Is Samacsys | N |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e4 |
长度 | 12.8 mm |
湿度敏感等级 | 1 |
负电源电压最大值(Vsup) | -5 V |
负电源电压最小值(Vsup) | -1 V |
标称负供电电压 (Vsup) | |
信道数量 | 8 |
功能数量 | 1 |
端子数量 | 20 |
标称断态隔离度 | 50 dB |
通态电阻匹配规范 | 8 Ω |
最大通态电阻 (Ron) | 160 Ω |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
座面最大高度 | 2.65 mm |
最大供电电压 (Vsup) | 5 V |
最小供电电压 (Vsup) | 1 V |
标称供电电压 (Vsup) | 6 V |
表面贴装 | YES |
最长断开时间 | 47 ns |
最长接通时间 | 51 ns |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 7.5 mm |
Base Number Matches | 1 |
74HC4351D,652 | 74HC4351D,653 | 74HCT4351D,112 | 74HCT4351DB,112 | 74HCT4351D,118 | 74HC4351DB,112 | |
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描述 | 74HC4351; 74HCT4351 - 8-channel analog multiplexer/demultiplexer with latch SOP 20-Pin | IC MUX/DEMUX 8X1 20SOIC | IC MUX/DEMUX 8X1 20SOIC | IC MUX/DEMUX 8X1 20SSOP | IC MUX/DEMUX 8X1 20SOIC | IC MUX/DEMUX 8X1 20SSOP |
Brand Name | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
厂商名称 | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
零件包装代码 | SOP | SOP | SOP | SSOP2 | SOP | SSOP2 |
包装说明 | SOT-163, SO-20 | SOT-163, SO-20 | SOP, | SOT-339, SSOP-20 | SOP, | SSOP, |
针数 | 20 | 20 | 20 | 20 | 20 | 20 |
制造商包装代码 | SOT163-1 | SOT163-1 | SOT163-1 | SOT339-1 | SOT163-1 | SOT339-1 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
长度 | 12.8 mm | 12.8 mm | 12.8 mm | 7.2 mm | 12.8 mm | 7.2 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
负电源电压最大值(Vsup) | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
负电源电压最小值(Vsup) | -1 V | -1 V | -1 V | -1 V | -1 V | -1 V |
信道数量 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
标称断态隔离度 | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB |
通态电阻匹配规范 | 8 Ω | 8 Ω | 9 Ω | 9 Ω | 9 Ω | 8 Ω |
最大通态电阻 (Ron) | 160 Ω | 160 Ω | 180 Ω | 180 Ω | 180 Ω | 160 Ω |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SOP | SSOP | SOP | SSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH |
座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | 2 mm | 2.65 mm | 2 mm |
最大供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
最小供电电压 (Vsup) | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
标称供电电压 (Vsup) | 6 V | 6 V | 4.5 V | 4.5 V | 4.5 V | 6 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
最长断开时间 | 47 ns | 47 ns | 65 ns | 65 ns | 65 ns | 47 ns |
最长接通时间 | 51 ns | 51 ns | 75 ns | 75 ns | 75 ns | 51 ns |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.5 mm | 7.5 mm | 7.5 mm | 5.3 mm | 7.5 mm | 5.3 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
峰值回流温度(摄氏度) | 260 | - | 260 | 260 | 260 | 260 |
处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 30 | 30 |
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