High Speed CMOS Logic 4-to-16 Line Decoder/Demultiplexer with Input Latches 24-SOIC -55 to 125
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | SOIC |
包装说明 | SOP, SOP24,.4 |
针数 | 24 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 1 week |
其他特性 | ADDRESS LATCHES |
系列 | HC/UH |
输入调节 | LATCHED |
JESD-30 代码 | R-PDSO-G24 |
JESD-609代码 | e4 |
长度 | 15.4 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | OTHER DECODER/DRIVER |
最大I(ol) | 0.0052 A |
湿度敏感等级 | 1 |
位数 | 16 |
功能数量 | 1 |
端子数量 | 24 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | INVERTED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP24,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
包装方法 | TUBE |
峰值回流温度(摄氏度) | 260 |
电源 | 2/6 V |
最大电源电流(ICC) | 0.08 mA |
Prop。Delay @ Nom-Sup | 23 ns |
传播延迟(tpd) | 415 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.65 mm |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 4.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.5 mm |
Base Number Matches | 1 |
CD74HC4515M | CD74HC4515MG4 | CD74HC4515M96E4 | CD74HC4515M96 | CD74HC4514MG4 | CD74HC4514ME4 | CD74HC4514M | CD74HC4514ENG4 | |
---|---|---|---|---|---|---|---|---|
描述 | High Speed CMOS Logic 4-to-16 Line Decoder/Demultiplexer with Input Latches 24-SOIC -55 to 125 | High Speed CMOS Logic 4-to-16 Line Decoder/Demultiplexer with Input Latches 24-SOIC -55 to 125 | High Speed CMOS Logic 4-to-16 Line Decoder/Demultiplexer with Input Latches 24-SOIC -55 to 125 | High Speed CMOS Logic 4-to-16 Line Decoder/Demultiplexer with Input Latches 24-SOIC -55 to 125 | High Speed CMOS Logic 4-to-16 Line Decoder/Demultiplexer with Input Latches 24-SOIC -55 to 125 | High Speed CMOS Logic 4-to-16 Line Decoder/Demultiplexer with Input Latches 24-SOIC -55 to 125 | High Speed CMOS Logic 4-to-16 Line Decoder/Demultiplexer with Input Latches 24-SOIC -55 to 125 | IC DECODER/DEMUX HS 4-16 24-DIP |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | - |
包装说明 | SOP, SOP24,.4 | SOP, SOP24,.4 | SOP, SOP24,.4 | SOP, SOP24,.4 | SOP, SOP24,.4 | SOP, SOP24,.4 | SOP, SOP24,.4 | - |
针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | - |
Reach Compliance Code | compliant | compli | compli | compliant | compli | compli | compliant | - |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
其他特性 | ADDRESS LATCHES | ADDRESS LATCHES | ADDRESS LATCHES | ADDRESS LATCHES | ADDRESS LATCHES | ADDRESS LATCHES | ADDRESS LATCHES | - |
系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | - |
输入调节 | LATCHED | LATCHED | LATCHED | LATCHED | LATCHED | LATCHED | LATCHED | - |
JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | - |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | - |
长度 | 15.4 mm | 15.4 mm | 15.4 mm | 15.4 mm | 15.4 mm | 15.4 mm | 15.4 mm | - |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - |
逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | - |
最大I(ol) | 0.0052 A | 0.004 A | 0.004 A | 0.0052 A | 0.004 A | 0.004 A | 0.0052 A | - |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | - |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | TRUE | TRUE | TRUE | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP | - |
封装等效代码 | SOP24,.4 | SOP24,.4 | SOP24,.4 | SOP24,.4 | SOP24,.4 | SOP24,.4 | SOP24,.4 | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - |
包装方法 | TUBE | TUBE | TAPE AND REEL | TR | TUBE | TUBE | TUBE | - |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | - |
电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | - |
传播延迟(tpd) | 415 ns | 415 ns | 415 ns | 415 ns | 415 ns | 415 ns | 415 ns | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | - |
最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | - |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | - |
标称供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | - |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
宽度 | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | - |
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