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CD74HC533EE4

产品描述High Speed CMOS Logic Octal Inverting Transparent Latches with 3-State Outputs 20-PDIP -55 to 125
产品类别逻辑    逻辑   
文件大小536KB,共16页
制造商Texas Instruments(德州仪器)
官网地址http://www.ti.com.cn/
标准
敬请期待 详细参数 选型对比

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CD74HC533EE4概述

High Speed CMOS Logic Octal Inverting Transparent Latches with 3-State Outputs 20-PDIP -55 to 125

CD74HC533EE4规格参数

参数名称属性值
Brand NameTexas Instruments
是否无铅不含铅
是否Rohs认证符合
零件包装代码DIP
包装说明DIP, DIP20,.3
针数20
Reach Compliance Codecompli
系列HC/UH
JESD-30 代码R-PDIP-T20
JESD-609代码e4
长度25.4 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
最大I(ol)0.006 A
位数8
功能数量1
端口数量2
端子数量20
最高工作温度125 °C
最低工作温度-55 °C
输出特性3-STATE
输出极性INVERTED
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP20,.3
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)NOT SPECIFIED
电源2/6 V
Prop。Delay @ Nom-Su50 ns
传播延迟(tpd)265 ns
认证状态Not Qualified
座面最大高度5.08 mm
最大供电电压 (Vsup)6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)4.5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.62 mm
Base Number Matches1

CD74HC533EE4相似产品对比

CD74HC533EE4 CD74HCT563M CD74HCT563E CD74HCT563MG4 CD74HCT563ME4 CD74HCT533EE4 CD74HCT533E CD74HC563E CD74HC533E CD74HCT533EG4
描述 High Speed CMOS Logic Octal Inverting Transparent Latches with 3-State Outputs 20-PDIP -55 to 125 High Speed CMOS Logic Octal Transparent Inverting Latches with 3-State Outputs 20-SOIC -55 to 125 High Speed CMOS Logic Octal Transparent Inverting Latches with 3-State Outputs 20-PDIP -55 to 125 High Speed CMOS Logic Octal Transparent Inverting Latches with 3-State Outputs 20-SOIC -55 to 125 High Speed CMOS Logic Octal Transparent Inverting Latches with 3-State Outputs 20-SOIC -55 to 125 High Speed CMOS Logic Octal Transparent Inverting Latches with 3-State Outputs 20-PDIP -55 to 125 High Speed CMOS Logic Octal Transparent Inverting Latches with 3-State Outputs 20-PDIP -55 to 125 High Speed CMOS Logic Octal Inverting Transparent Latches with 3-State Outputs 20-PDIP -55 to 125 High Speed CMOS Logic Octal Inverting Transparent Latches with 3-State Outputs 20-PDIP -55 to 125 IC OCT TRANSP LTCH INV 3ST 20DIP
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments -
是否无铅 不含铅 不含铅 不含铅 - - 不含铅 不含铅 不含铅 不含铅 -
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合 -
零件包装代码 DIP SOIC DIP SOIC SOIC DIP DIP DIP DIP -
包装说明 DIP, DIP20,.3 SOIC-20 DIP, DIP20,.3 SOP, SOP20,.4 SOP, SOP20,.4 DIP-20 DIP-20 DIP, DIP20,.3 DIP, DIP20,.3 -
针数 20 20 20 20 20 20 20 20 20 -
Reach Compliance Code compli compli compli compli compli compli compli compli compli -
系列 HC/UH HCT HCT HCT HCT HCT HCT HC HC/UH -
JESD-30 代码 R-PDIP-T20 R-PDSO-G20 R-PDIP-T20 R-PDSO-G20 R-PDSO-G20 R-PDIP-T20 R-PDIP-T20 R-PDIP-T20 R-PDIP-T20 -
JESD-609代码 e4 e4 e4 e4 e4 e4 e4 e4 e4 -
长度 25.4 mm 12.8 mm 24.33 mm 12.8 mm 12.8 mm 25.4 mm 24.33 mm 25.4 mm 24.33 mm -
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF -
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER -
最大I(ol) 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A 0.0078 A 0.0078 A -
位数 8 8 8 8 8 8 8 8 8 -
功能数量 1 1 1 1 1 1 1 1 1 -
端口数量 2 2 2 2 2 2 2 2 2 -
端子数量 20 20 20 20 20 20 20 20 20 -
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C -
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE -
输出极性 INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED INVERTED -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 DIP SOP DIP SOP SOP DIP DIP DIP DIP -
封装等效代码 DIP20,.3 SOP20,.4 DIP20,.3 SOP20,.4 SOP20,.4 DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3 -
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE IN-LINE -
峰值回流温度(摄氏度) NOT SPECIFIED 260 NOT SPECIFIED 260 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
电源 2/6 V 5 V 5 V 5 V 5 V 5 V 5 V 2/6 V 2/6 V -
Prop。Delay @ Nom-Su 50 ns 45 ns 45 ns 45 ns 45 ns 51 ns 51 ns 45 ns 50 ns -
传播延迟(tpd) 265 ns 53 ns 53 ns 53 ns 53 ns 57 ns 57 ns 250 ns 265 ns -
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
座面最大高度 5.08 mm 2.65 mm 5.08 mm 2.65 mm 2.65 mm 5.08 mm 5.08 mm 5.08 mm 5.08 mm -
最大供电电压 (Vsup) 6 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 6 V 6 V -
最小供电电压 (Vsup) 2 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 2 V 2 V -
标称供电电压 (Vsup) 4.5 V 5 V 5 V 5 V 5 V 5 V 5 V 4.5 V 4.5 V -
表面贴装 NO YES NO YES YES NO NO NO NO -
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS -
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY -
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) -
端子形式 THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE -
端子节距 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm -
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL -
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
宽度 7.62 mm 7.5 mm 6.35 mm 7.5 mm 7.5 mm 7.62 mm 6.35 mm 7.62 mm 6.35 mm -
Base Number Matches 1 - 1 1 - 1 1 - 1 -

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