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5962-8956703XA

产品描述FIFO, 2KX9, 65ns, Asynchronous, CMOS, 0.300 INCH, THIN, CERAMIC, DIP-28
产品类别存储    存储   
文件大小147KB,共19页
制造商TEMIC
官网地址http://www.temic.de/
下载文档 详细参数 选型对比 全文预览

5962-8956703XA概述

FIFO, 2KX9, 65ns, Asynchronous, CMOS, 0.300 INCH, THIN, CERAMIC, DIP-28

5962-8956703XA规格参数

参数名称属性值
厂商名称TEMIC
包装说明0.300 INCH, THIN, CERAMIC, DIP-28
Reach Compliance Codeunknown
最长访问时间65 ns
其他特性RETRANSMIT
周期时间80 ns
JESD-609代码e0
长度37.1475 mm
内存密度18432 bit
内存宽度9
功能数量1
字数2048 words
字数代码2000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织2KX9
可输出NO
封装主体材料CERAMIC, GLASS-SEALED
封装代码DIP
封装形式IN-LINE
并行/串行PARALLEL
认证状态Not Qualified
座面最大高度5.08 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
宽度7.62 mm
Base Number Matches1

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REVISIONS
LTR
DESCRIPTION
DATE
APPROVED
A
Updated boilerplate to reflect current requirements and made
corrections to table I and waveforms. Separated source bulletin from
the body of the drawing. - glg
01-01-30
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
A
15
A
16
A
17
A
18
REV
SHEET
PREPARED BY
Kenneth Rice
CHECKED BY
Charles Reusing
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY All DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
APPROVED BY
Monica L. Poelking
MICROCIRCUIT, MEMORY, DIGITAL, CMOS,
2K X 9 FIFO, MONOLITHIC SILICON
DRAWING APPROVAL DATE
27 March 1990
REVISION LEVEL
SIZE
A
A
SHEET
CAGE CODE
67268
1 OF
18
5962-89567
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E180-01

5962-8956703XA相似产品对比

5962-8956703XA 5962-8956705XA 5962-8956704ZC 5962-8956701ZC 5962-8956703ZC 5962-8956701XA 5962-8956704XA 5962-8956702ZC 5962-8956702XA 5962-8956705ZC
描述 FIFO, 2KX9, 65ns, Asynchronous, CMOS, 0.300 INCH, THIN, CERAMIC, DIP-28 FIFO, 2KX9, 40ns, Asynchronous, CMOS, 0.300 INCH, THIN, CERAMIC, DIP-28 FIFO, 2KX9, 50ns, Asynchronous, CMOS, FIFO, 2KX9, 120ns, Asynchronous, CMOS, FIFO, 2KX9, 65ns, Asynchronous, CMOS, FIFO, 2KX9, 120ns, Asynchronous, CMOS, CDIP28, FIFO, 2KX9, 50ns, Asynchronous, CMOS, 0.300 INCH, THIN, CERAMIC, DIP-28 FIFO, 2KX9, 80ns, Asynchronous, CMOS, FIFO, 2KX9, 80ns, Asynchronous, CMOS, 0.300 INCH, THIN, CERAMIC, DIP-28 FIFO, 2KX9, 40ns, Asynchronous, CMOS,
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
最长访问时间 65 ns 40 ns 50 ns 120 ns 65 ns 120 ns 50 ns 80 ns 80 ns 40 ns
其他特性 RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT RETRANSMIT
周期时间 80 ns 50 ns 65 ns 140 ns 80 ns 140 ns 65 ns 100 ns 100 ns 50 ns
JESD-609代码 e0 e0 e4 e4 e4 e0 e0 e4 e0 e4
长度 37.1475 mm 37.1475 mm 13.97 mm 13.97 mm 13.97 mm 37.1475 mm 37.1475 mm 13.97 mm 37.1475 mm 13.97 mm
内存密度 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit 18432 bit
内存宽度 9 9 9 9 9 9 9 9 9 9
功能数量 1 1 1 1 1 1 1 1 1 1
字数 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
字数代码 2000 2000 2000 2000 2000 2000 2000 2000 2000 2000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
组织 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9 2KX9
可输出 NO NO NO NO NO NO NO NO NO NO
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
封装代码 DIP DIP QCCN QCCN QCCN DIP DIP QCCN DIP QCCN
封装形式 IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.08 mm 5.08 mm 3.048 mm 3.048 mm 3.048 mm 5.08 mm 5.08 mm 3.048 mm 5.08 mm 3.048 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO YES YES YES NO NO YES NO YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子面层 TIN LEAD TIN LEAD GOLD GOLD GOLD TIN LEAD TIN LEAD GOLD TIN LEAD GOLD
端子形式 THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD
端子节距 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm
端子位置 DUAL DUAL QUAD QUAD QUAD DUAL DUAL QUAD DUAL QUAD
宽度 7.62 mm 7.62 mm 11.43 mm 11.43 mm 11.43 mm 7.62 mm 7.62 mm 11.43 mm 7.62 mm 11.43 mm
厂商名称 TEMIC - TEMIC TEMIC TEMIC TEMIC TEMIC TEMIC TEMIC TEMIC
Base Number Matches 1 1 1 1 1 1 1 1 1 -
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