Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, PDIP24,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DIP, DIP24,.6 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDIP-T24 |
| 信道数量 | 16 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最大通态电阻 (Ron) | 225 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大信号电流 | 0.025 A |
| 最大供电电流 (Isup) | 0.08 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 最长接通时间 | 65 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 74HCT4067N | 74HCT4067D | 74HC4067N | 74HC4067D | |
|---|---|---|---|---|
| 描述 | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, PDIP24, | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, PDSO24 | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, PDIP24, | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, PDSO24 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DIP, DIP24,.6 | SOP, SOP24,.4 | DIP, DIP24,.6 | SOP, SOP24,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 | R-PDSO-G24 |
| 信道数量 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 |
| 最大通态电阻 (Ron) | 225 Ω | 225 Ω | 225 Ω | 225 Ω |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | DIP | SOP |
| 封装等效代码 | DIP24,.6 | SOP24,.4 | DIP24,.6 | SOP24,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 电源 | 5 V | 5 V | 2/9 V | 2/9 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大信号电流 | 0.025 A | 0.025 A | 0.025 A | 0.025 A |
| 最大供电电流 (Isup) | 0.08 mA | 0.08 mA | 0.16 mA | 0.16 mA |
| 表面贴装 | NO | YES | NO | YES |
| 最长接通时间 | 65 ns | 65 ns | 300 ns | 300 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 |
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