Thick Film High Voltage/
High Reliability MIL-Approved
Metal Glaze™ Resistors
CMH Series
•
•
•
•
•
1/4 watt to 5 watt
TCR of ±100 ppm/°C
Qualified to MIL-R-49462
330K ohm to 1G ohm range
±1%, ±2%, or ±5% tolerance
Diamond spiraled
thick film element
Heat conducting
ceramic substrate
Epoxy coated body
High conductivity plated on
nickel termination
All welded cap and lead construction
Tin Lead electroplated leads
Electrical Data
IRC Type
CMH - 1/4
CMH - 1/2
CMH - 1
CMH - 2
CMH - 3
CMH - 5
MIL
Type³
RHV30
RHV31
RHV32
RHV33
RHV34
RHV35
Power
Rating @
70°C (watts)¹
1/4
1/2
1
2
3
5
Voltage
Rating
(volts)²
750
1,500
3,000
5,000
10,000
20,000
Resistance Range
(ohms)
4
330K - 100M
330K - 392M
330K - 499M
330K - 499M
330K - 1000M
330K - 1000M
1, 2, 5
100
0 to -5
Tolerance
(±%)
Maximum
TCR
(±ppm/°C)
4
VCR (ppm/V)
Notes:
1. For power rating above 70C, see derating curve.
2. Voltage rating shown is the rated DC continuous working voltage or the sine-wave RMS absolute maximum voltage at com-
mercial line frequency.
3. Marked per MIL-R-49462
4. Values greater than 100 meg and less than 500 meg, ±200ppm; values greater than or equal to 500 meg, ±500ppm.
Environmental Data
Test Condition*
Thermal Shock
Solder Effect
Terminal Strength
Moisture Resistance
Load Life (1000 Hours at 25°C)
Shelf Life (1 year at 25°C)
Low-Temperature Operation
Shock
Vibration
Dielectric Strength
Insulation Resistance at 500 VDC
Notes:
*Test per MIL-R-49462 and MIL-STD-202
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Maximum
∆R
(±3σ)
±0.25%
±0.15%
±0.20%
±0.50%
±1.00%
±0.10%
±0.15%
±0.35%
±0.35%
±0.15%
±10
9
Ω
min
Typical
∆R
±0.10%
±0.05%
±0.10%
±0.20%
±0.25%
±0.03%
±0.05%
±0.10%
±0.10%
±0.05%
5 x 10
12
Ω
typ
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
CMH Series Issue September 2008 Sheet 1 of 3
Thick Film High Voltage/
High Reliability MIL-Approved
Metal Glaze™ Resistors
Physical Data
1.50 ± 0.125
(38.1 ± 3.2)
BL
IRC Advanced Film Division
0.032 (0.81) DIA.*
BD
CL
*CMH 1/4 leads are
0.025 (0.64) in diameter
Dimensions (Inches and (mm))
IRC Type
CMH - 1/4
CMH - 1/2
CMH - 1
CMH - 2
CMH - 3
CMH - 5
Body Length - BL
0.275 ± 0.031 (6.98 ± 0.79)
0.400 ± 0.031 (10.16 ± 0.79)
0.690 ± 0.062 (17.53 ± 1.57)
1.062 ± 0.062 (26.97 ± 1.57)
2.062 ± 0.062 (52.37 ± 1.57)
3.062 ± 0.062 (77.77 ± 1.57)
Body Diameter - BD
0.088 ± 0.010 (2.22 ± 0.25)
0.138 ± 0.016 (3.51 ± 0.41)
0.297 ± 0.031 (7.54 ± 0.79)
0.297 ± 0.031 (7.54 ± 0.79)
0.297 ± 0.031 (7.54 ± 0.79)
0.297 ± 0.031 (7.54 ± 0.79)
Clean Lead to Clean Lead - CL
0.400 (10.16)
0.525 (13.34)
0.900 (22.86)
1.250 (31.75)
2.250 (57.15)
3.250 (82.55)
Power Derating Curve
100
90
% of Rated Power
80
70
60
50
40
30
20
10
0
80
100
120
140
160
180
Temperature Rise Chart
100
90
% of Rated Power
80
70
60
50
40
30
20
10
0
0
10
20
30
40
50
60
70
80
90
CMH 1/4
CMH 2-3
CMH 1/2
CMH 5
CMH 1
Ambient Temperature (°C)
Temperature Rise (°C)
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
CMH Series Issue September 2008 Sheet 2 of 3
Thick Film High Voltage/
High Reliability MIL-Approved
Metal Glaze™ Resistors
Ordering Data
Sample Part No.
IRC Type
CMH 3 - 100 - 2206 - F
IRC Advanced Film Division
CMH 1/4, CMH 1/2, CMH 1, CMH 2, CMH 3, CMH 5
Temperature Coefficient
±100 ppm/°C
(≥100Ω - First 3 significant digits plus 4th digit multiplier)
Example: 100Ω = 1000; 1000Ω = 1001, 150,000Ω = 1503
(>100Ω - "R" is used to designate decimal)
Example: 51Ω = 51R0; 1Ω = 1R00; 0.25Ω = R250
Resistance
Tolerance
F = ±1%
G = ±2%
J = ±5%
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
CMH Series Issue September 2008 Sheet 3 of 3
嵌入式系统
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