74HCT75N概述

IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16, FF/Latch

74HCT75N规格参数

参数名称	属性值
厂商名称	NXP(恩智浦)
零件包装代码	DIP
包装说明	DIP,
针数	16
Reach Compliance Code	unknown
系列	HCT
JESD-30 代码	R-PDIP-T16
长度	21.6 mm
负载电容（CL）	50 pF
逻辑集成电路类型	D LATCH
位数	2
功能数量	2
端子数量	16
最高工作温度	125 °C
最低工作温度	-40 °C
输出极性	COMPLEMENTARY
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
传播延迟（tpd）	45 ns
认证状态	Not Qualified
座面最大高度	4.7 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	AUTOMOTIVE
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
触发器类型	HIGH LEVEL
宽度	7.62 mm
最小 fmax	60 MHz

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74HCT75N相似产品对比

	74HCT75N	74HCT75NB	74HCT75D	74HCT75DB	74HCT75DB-T	74HCT75PW	74HCT75PW-T	74HC75NB
描述	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16, FF/Latch	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDIP16, FF/Latch	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, SO-16, FF/Latch	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, SSOP-16, FF/Latch	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, SSOP-16, FF/Latch	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16, FF/Latch	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16, FF/Latch	HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDIP16
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
系列	HCT	HCT	HCT	HCT	HCT	HCT	HCT	HC/UH
JESD-30 代码	R-PDIP-T16	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDIP-T16
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
位数	2	2	2	2	2	2	2	2
功能数量	2	2	2	2	2	2	2	2
端子数量	16	16	16	16	16	16	16	16
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
输出极性	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIP	DIP	SOP	SSOP	SSOP	TSSOP	TSSOP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE
传播延迟（tpd）	45 ns	45 ns	45 ns	45 ns	45 ns	45 ns	45 ns	38 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	6 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	2 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	YES	YES	YES	YES	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子形式	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
触发器类型	HIGH LEVEL	HIGH LEVEL	HIGH LEVEL	HIGH LEVEL	HIGH LEVEL	HIGH LEVEL	HIGH LEVEL	HIGH LEVEL
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	-	-	NXP(恩智浦)
包装说明	DIP,	DIP,	PLASTIC, SO-16	PLASTIC, SSOP-16	PLASTIC, SSOP-16	TSSOP,	TSSOP,	-
长度	21.6 mm	19.025 mm	-	6.2 mm	6.2 mm	5 mm	5 mm	19.025 mm
座面最大高度	4.7 mm	4.2 mm	-	2 mm	2 mm	1.1 mm	1.1 mm	4.2 mm
端子节距	2.54 mm	2.54 mm	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm	2.54 mm
宽度	7.62 mm	7.62 mm	-	5.3 mm	5.3 mm	4.4 mm	4.4 mm	7.62 mm
最小 fmax	60 MHz	-	60 MHz	60 MHz	60 MHz	60 MHz	60 MHz	-
Base Number Matches	-	1	1	1	1	1	1	-
Is Samacsys	-	-	N	N	N	N	N	-

74HCT75N

74HCT75N概述

74HCT75N规格参数

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74HCT75N相似产品对比

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