74HCT75D概述

IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, SO-16, FF/Latch

74HCT75D规格参数

参数名称	属性值
厂商名称	NXP(恩智浦)
零件包装代码	SOIC
包装说明	PLASTIC, SO-16
针数	16
Reach Compliance Code	unknown
Is Samacsys	N
系列	HCT
JESD-30 代码	R-PDSO-G16
负载电容（CL）	50 pF
逻辑集成电路类型	D LATCH
位数	2
功能数量	2
端子数量	16
最高工作温度	125 °C
最低工作温度	-40 °C
输出极性	COMPLEMENTARY
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
传播延迟（tpd）	45 ns
认证状态	Not Qualified
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子形式	GULL WING
端子位置	DUAL
触发器类型	HIGH LEVEL
最小 fmax	60 MHz
Base Number Matches	1

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74HCT75D相似产品对比

	74HCT75D	74HCT75NB	74HCT75DB	74HCT75DB-T	74HCT75PW	74HCT75PW-T	74HCT75N	74HC75NB
描述	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, SO-16, FF/Latch	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDIP16, FF/Latch	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, SSOP-16, FF/Latch	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, SSOP-16, FF/Latch	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16, FF/Latch	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16, FF/Latch	IC HCT SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16, FF/Latch	HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDIP16
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
系列	HCT	HCT	HCT	HCT	HCT	HCT	HCT	HC/UH
JESD-30 代码	R-PDSO-G16	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDIP-T16	R-PDIP-T16
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
位数	2	2	2	2	2	2	2	2
功能数量	2	2	2	2	2	2	2	2
端子数量	16	16	16	16	16	16	16	16
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
输出极性	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	DIP	SSOP	SSOP	TSSOP	TSSOP	DIP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	IN-LINE
传播延迟（tpd）	45 ns	45 ns	45 ns	45 ns	45 ns	45 ns	45 ns	38 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	6 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	2 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	NO	YES	YES	YES	YES	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子形式	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
触发器类型	HIGH LEVEL	HIGH LEVEL	HIGH LEVEL	HIGH LEVEL	HIGH LEVEL	HIGH LEVEL	HIGH LEVEL	HIGH LEVEL
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	-	-	NXP(恩智浦)	NXP(恩智浦)
包装说明	PLASTIC, SO-16	DIP,	PLASTIC, SSOP-16	PLASTIC, SSOP-16	TSSOP,	TSSOP,	DIP,	-
Is Samacsys	N	-	N	N	N	N	-	-
最小 fmax	60 MHz	-	60 MHz	60 MHz	60 MHz	60 MHz	60 MHz	-
Base Number Matches	1	1	1	1	1	1	-	-
长度	-	19.025 mm	6.2 mm	6.2 mm	5 mm	5 mm	21.6 mm	19.025 mm
座面最大高度	-	4.2 mm	2 mm	2 mm	1.1 mm	1.1 mm	4.7 mm	4.2 mm
端子节距	-	2.54 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	2.54 mm	2.54 mm
宽度	-	7.62 mm	5.3 mm	5.3 mm	4.4 mm	4.4 mm	7.62 mm	7.62 mm

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