Connection
Systems
Memory Module Sockets
Surface Mount
DDR SO-DIMM
Sockets
Description:
Sockets for Double Data Rate Small Outline DRAM memory modules
Typical Applications:
Notebook computers
Small form factor servers
Small form factor network routers, switches and hubs
Benefits/Features:
Flexible System . . . . . The 200 position socket is available in standard and reverse keying options for dual socket implementation.
Sockets are available for 1.8 V or 2.5 V modules.
Sockets are available in 4.0 mm or 5.2 mm module stack heights.
Industry Standard . . . . Meets JEDEC MO-224 module mating requirements for DDR SO-DIMM.
Ruggedness . . . . . . . . Metal reinforced retention latches hold module securely.
Reliability . . . . . . . . . Several gold plating options are available for improved reliability.
Selectable Features:
Product Type
Total No. of Positions
Centerline Spacing
Orientation
Mounting Style
Voltage
Insertion Style
Contact Style
Contact Area Plating
Height Above Board
Housing Color
DDR SO-DIMM Sockets
200
0.60 mm [.024 in.]
Horizontal
Surface mount
1.8 V, 2.5 V
Cam-in
Formed
Gold-plated (see product
print for thickness)
4.0 mm [.157 in.]
5.2 mm [.205 in.]
Black or tan (natural)
Other Properties:
PCB Retention Feature
Packaging Type
Housing Material
Applicable Soldering Process
Contact Base Material
Latch Base Material
Floating Tab Material
Insulation Resistance
Withstanding Voltage
Current Rating
Contact Resistance
Voltage Rating
Temperature Range
Normal Force
Contact Retention Force
Latch Spring Retention Force
Durability (Mating Cycles)
PCB Mating Force
Plating (Contact Area)
Plating (Soldering End)
Plating (Floating Tab)
Underplating
Standards
Approvals and Certification
Yes
Tray
LCP
IR, vapor phase, wave
Copper alloy
Stainless steel
Copper alloy
250 MΩ (initial)
500 VAC (initial)
0.3 amp max. per contact
30 mΩ (initial)
25 VAC
-55°C to +85°C
0.69 N [70 gf] min.
4.90 N [500 gf] min.
19.62 N [2000 gf] min.
25
9.81 N [1000 gf] max.
Gold (thickness varies per Delphi spec.) over nickel underplating
2.54 µm [100 µin.] tin-lead over nickel underplating
2.54 µm [100 µin.] tin-lead over nickel underplating
1.27 µm [50 µin.] nickel
JEDEC MO-224
UL approved
Surface Mount DDR SO-DIMM Sockets
Ordering Nomenclature
Standard Type
Standard Type
1543 1499 – 1 3 2
Reverse Type
1543 1500 – 1 3 2
Plating:
1
= Gold flash
2
= 0.38 µm [15 µin.] gold
Voltage/Color:
1
= 1.8 V - black
2
= 2.5 V - black
3
= 1.8 V - tan (natural)
4
= 2.5 V - tan (natural)
Height Above Board (Dim. “D”):
1
= 4.0 [.157]
2
= 5.2 [.205]
Reverse Type
1.8 V
1.8 V
2.5 V
2.5 V
1.8 V
1.8 V
2.5 V
2.5 V
Black
Black
Black
Black
Tan
Tan
Tan
Tan
2.4
[.09]
2.4
[.09]
1.5
[.06]
1.5
[.06]
2.4
[.09]
2.4
[.09]
1.5
[.06]
1.5
[.06]
2.7
[.11]
2.7
[.11]
1.8
[.07]
1.8
[.07]
2.7
[.11]
2.7
[.11]
1.8
[.07]
1.8
[.07]
17
.55
[.691]
17
.55
[.691]
18.45
[.726]
18.45
[.726]
17
.55
[.691]
17
.55
[.691]
18.45
[.726]
18.45
[.726]
4.0
[.16]
5.2
[.20]
4.0
[.16]
5.2
[.20]
4.0
[.16]
5.2
[.20]
4.0
[.16]
5.2
[.20]
Unless otherwise specified, dimensions are shown in millimeters and [inches].
For additional information, please contact us or visit our website.
www.delphi.com/connect
Printed on Recycled Paper.
© 2003, Delphi. All rights reserved.
Printed in the U.S.A.
DP-03-E-094
203/3w • 503/GBS-5m
Connection Systems
19200 Asheville Highway
P Box 519
.O.
Landrum, SC 29356 U.S.A.
Tel: [1] 864.457.3824
Fax: [1] 864.457.2535
NOR X.X
2 .5 V
mm
Power
Supply
Color
Dim.
“A”
Dim.
“B”
Dim.
“C”
Dim.
“D”
NOR X.X
2 .5 V
mm
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