74HC74BQ-Q100: 产品描述HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14; 产品类别逻辑逻辑; 文件大小266KB，共20页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74HC74BQ-Q100概述

HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14

74HC74BQ-Q100规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	QFN
包装说明	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
针数	14
Reach Compliance Code	unknown
系列	HC/UH
JESD-30 代码	R-PQCC-N14
长度	3 mm
逻辑集成电路类型	D FLIP-FLOP
湿度敏感等级	1
位数	1
功能数量	2
端子数量	14
最高工作温度	125 °C
最低工作温度	-40 °C
输出极性	COMPLEMENTARY
封装主体材料	PLASTIC/EPOXY
封装代码	HVQCCN
封装形状	RECTANGULAR
封装形式	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）	260
传播延迟（tpd）	265 ns
筛选级别	AEC-Q100
座面最大高度	1 mm
最大供电电压 (Vsup)	6 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子形式	NO LEAD
端子节距	0.5 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	30
触发器类型	POSITIVE EDGE
宽度	2.5 mm
最小 fmax	24 MHz

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74HC74-Q100; 74HCT74-Q100

Dual D-type flip-flop with set and reset; positive edge-trigger

Rev. 2 — 6 September 2013

Product data sheet

1. General description

The 74HC74-Q100; 74HCT74-Q100 are dual positive edge triggered D-type flip-flop with

individual data (nD), clock (nCP), set (nSD) and reset (nRD) inputs, and complementary

nQ and nQ outputs. Data at the nD-input, that meets the set-up and hold time

requirements on the LOW-to-HIGH clock transition, will be stored in the flip-flop and

appear at the nQ output. The Schmitt-trigger action in the clock input, makes the circuit

highly tolerant to slower clock rise and fall times. Inputs include clamp diodes. This

enables the use of current limiting resistors to interface inputs to voltages in excess of

This product has been qualified to the Automotive Electronics Council (AEC) standard

Q100 (Grade 1) and is suitable for use in automotive applications.

2. Features and benefits



Automotive product qualification in accordance with AEC-Q100 (Grade 1)



Specified from

40 C

to +85

C

and from

40 C

to +125

C



Input levels:



For 74HC74-Q100: CMOS level



For 74HCT74-Q100: TTL level



Symmetrical output impedance



Low power dissipation



High noise immunity



Balanced propagation delays



Specified in compliance with JEDEC standard no. 7A



ESD protection:



MIL-STD-883, method 3015 exceeds 2000 V



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0

)



Multiple package options

74HC74BQ-Q100相似产品对比

	74HC74BQ-Q100	74HC74N-Q100	74HC74PW-Q100	74HCT74BQ-Q100	74HCT74D-Q100	74HCT74PW-Q100	74HC74D-Q100
描述	HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14	HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14, 0.300 INCH, PLASTIC, SC501-14, MO-001, SOT27-1, DIP-14	HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14	HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14	HCT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14	IC D FLIP-FLOP, FF/Latch	HC/UH SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
零件包装代码	QFN	MO-001	TSSOP	QFN	SOIC	TSSOP	SOIC
包装说明	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14	DIP,	TSSOP,	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14	4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
针数	14	14	14	14	14	14	14
Reach Compliance Code	unknown	unknow	unknown	unknown	unknown	unknown	unknow
系列	HC/UH	HC/UH	HC/UH	HCT	HCT	HCT	HC/UH
JESD-30 代码	R-PQCC-N14	R-PDIP-T14	R-PDSO-G14	R-PQCC-N14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14
长度	3 mm	19.025 mm	5 mm	3 mm	8.65 mm	5 mm	8.65 mm
逻辑集成电路类型	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP
位数	1	1	1	1	1	1	1
功能数量	2	2	2	2	2	2	2
端子数量	14	14	14	14	14	14	14
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
输出极性	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HVQCCN	DIP	TSSOP	HVQCCN	SOP	TSSOP	SOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
传播延迟（tpd）	265 ns	265 ns	265 ns	53 ns	53 ns	53 ns	265 ns
筛选级别	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100	AEC-Q100
座面最大高度	1 mm	4.2 mm	1.1 mm	1 mm	1.75 mm	1.1 mm	1.75 mm
最大供电电压 (Vsup)	6 V	6 V	6 V	5.5 V	5.5 V	5.5 V	6 V
最小供电电压 (Vsup)	2 V	2 V	2 V	4.5 V	4.5 V	4.5 V	2 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	NO	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子形式	NO LEAD	THROUGH-HOLE	GULL WING	NO LEAD	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	2.54 mm	0.65 mm	0.5 mm	1.27 mm	0.65 mm	1.27 mm
端子位置	QUAD	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL
触发器类型	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE
宽度	2.5 mm	7.62 mm	4.4 mm	2.5 mm	3.9 mm	4.4 mm	3.9 mm
最小 fmax	24 MHz	24 MHz	24 MHz	18 MHz	18 MHz	18 MHz	24 MHz
是否Rohs认证	符合	-	符合	符合	符合	符合	符合
厂商名称	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
湿度敏感等级	1	-	1	1	1	1	1
峰值回流温度（摄氏度）	260	-	260	260	260	260	260
处于峰值回流温度下的最长时间	30	-	30	30	30	30	30

74HC74BQ-Q100

74HC74BQ-Q100概述

74HC74BQ-Q100规格参数

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74HC74BQ-Q100相似产品对比

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